Semiconductor Module Package Terminal Configuration for Three-Level Inverter

Solution Overview

Problem

The existing semiconductor module configurations for three-level inverters require multiple dedicated packages for various current and voltage ratings, leading to increased costs and complexity in manufacturing, as existing packages cannot be reused across different capacity and voltage ranges.

Innovation Solution

A semiconductor module configuration using existing packages with specific terminal arrangements, including IGBTs and reverse blocking IGBTs, allows for the creation of upper and lower arm kits that can support broad current and voltage ranges without the need for new package development, by using existing packages with specific terminal connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple dedicated packages are developed for various current and voltage ratings, then the semiconductor module can support different capacity ranges, but the development cost and manufacturing complexity increase

Engineering Contradiction:

Improvesupport for different current and voltage ratingsVSAvoidnumber of package variations

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies universality by designing a single standardized package that can accommodate IGBTs, reverse blocking IGBTs, and freewheeling diodes with different current and voltage ratings. The package includes multiple connection terminals (first connection terminal, second connection terminal, third connection terminal, fourth connection terminal) that can be configured to support various circuit topologies including three-level inverters, NPC inverters, and T-type inverters. This single package design replaces the need for multiple dedicated packages, thereby reducing development cost and manufacturing complexity while maintaining adaptability across different power ratings.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple dedicated packages are developed for various current and voltage ratings, then the semiconductor module can support different capacity ranges, but the manufacturing cost increases

Engineering Contradiction:

Improvesupport for different current and voltage ratingsVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent applies universality by designing a single standardized package that can accommodate IGBTs, reverse blocking IGBTs, and freewheeling diodes with different current and voltage ratings. The package includes multiple connection terminals (first connection terminal, second connection terminal, third connection terminal, fourth connection terminal) that can be configured to support various circuit topologies including three-level inverters, NPC inverters, and T-type inverters. This single package design replaces the need for multiple dedicated packages, thereby reducing development cost and manufacturing complexity while maintaining adaptability across different power ratings.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If existing packages are reused across different capacity and voltage ranges, then development cost and manufacturing complexity are reduced, but the package must accommodate diverse electrical requirements

Engineering Contradiction:

Improvereusability of existing packagesVSAvoidaccommodation of diverse electrical requirements

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent applies universality by designing a single standardized package that can accommodate IGBTs, reverse blocking IGBTs, and freewheeling diodes with different current and voltage ratings. The package includes multiple connection terminals (first connection terminal, second connection terminal, third connection terminal, fourth connection terminal) that can be configured to support various circuit topologies including three-level inverters, NPC inverters, and T-type inverters. This single package design replaces the need for multiple dedicated packages, thereby reducing development cost and manufacturing complexity while maintaining adaptability across different power ratings.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent applies segmentation by dividing the package into distinct functional regions with separate connection terminals for different electrical connections. The package structure includes a first connection terminal connected to the collector of the IGBT, a second connection terminal connected to the emitter of the IGBT, a third connection terminal connected to the collector of the reverse blocking IGBT, and a fourth connection terminal connected to the emitter of the reverse blocking IGBT. This segmented terminal arrangement allows flexible configuration to meet diverse electrical requirements while using a single standardized package body.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS10003280B2Semiconductor module, upper and lower arm kit, and three-level inverter

Publication Date: 2018.06.19 FUJI ELECTRIC CO LTD

AI summary

A semiconductor module, an upper and lower arm kit, and a three-level inverter can be provided at low cost and with broad current ratings and voltage ratings using existing packages, without developing new packages. A first semiconductor module on an upper arm side and a second semiconductor module on a lower arm side are made using an existing package, and the semiconductor modules and are used to configure an upper and lower arm kit. Further, the upper and lower arm kit is used to configure a three-level inverter. These devices can be formed using existing packages, and semiconductor modules, the upper and lower arm kit, and the three-level inverter can be therefore provided at low cost and with broad current ratings and voltage ratings.