Semiconductor Module PCB Heat Dissipation for Welding Transformers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor modules for high-current applications, such as welding transformers, face challenges in compact design and cost-effectiveness due to complex production processes and space-consuming designs that lead to high material costs and potential overheating issues.
Innovation Solution
A semiconductor module design utilizing two printed circuit boards with semiconductor switching elements connected between them, allowing for efficient heat dissipation and reduced material costs through a compact structure, using standard printed circuit boards and simplified assembly processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional semiconductor module designs are used with multiple connections and heat sinks, then heat dissipation is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple functions into the printed circuit board itself: the PCB serves as both the electrical connection substrate and the heat dissipation structure. The ground plane on the PCB acts as an integrated heat sink, eliminating the need for separate heat dissipation components while maintaining effective thermal management for high-current applications.
2Temperature
If conventional semiconductor module designs are used with multiple connections and heat sinks, then heat dissipation is improved, but manufacturing cost increases
Solution Approach 1:
The patent integrates heat dissipation functionality directly into the printed circuit board's ground plane, eliminating the need for separate heat sink components and their associated assembly steps. This reduction in component count and assembly complexity directly lowers manufacturing costs while maintaining effective thermal management.
3Ease of manufacture
If standard printed circuit boards are used, then manufacturing cost is reduced, but heat dissipation capability is limited
Solution Approach 1:
The patent makes the printed circuit board perform multiple functions simultaneously: electrical signal transmission, power distribution, and heat dissipation. The ground plane is designed to serve as both an electrical reference plane and a thermal management structure, allowing standard PCB manufacturing processes to produce modules suitable for high-current applications.
4Volume of moving object
If compact design is implemented, then device size is reduced, but heat dissipation efficiency may be compromised
Solution Approach 1:
The patent eliminates the need for separate heat dissipation components by integrating the thermal management function into the PCB structure itself. The ground plane serves as an integrated heat sink that is inherently part of the compact module design, so heat dissipation efficiency is maintained without requiring additional space for separate cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable operation with high currents (up to 30,000 A) while minimizing overheating and resource requirements, reducing production complexity and costs, leading to lower maintenance and power loss.
Implementation Method 1
The semiconductor module has a first printed circuit board, a second printed circuit board, and at least one semiconductor switching element for switching an electrical current greater than 10000 A, the at least one semiconductor switching element being electrically connected between the first and second printed circuit boards in such a way that one of the at least electric current switched by a semiconductor switching element can flow from the first circuit board into the second circuit board
Implementation Method 2
In order for such applications to function correctly, it must be ensured that the contact points between the components and the printed circuit board are both able to carry current and sufficiently dissipate heat generated by the electrical power loss in the components
Data Source
Figure 1~2
Figure 3~4
Figure 5~7
AI summary
A semiconductor module (41 to 44; 401; 402) for an electrical device (40) and a method for manufacturing such a semiconductor module (41 to 44; 401; 402) are provided. The electrical device (40) is, in particular, a rectifier (40) for a welding transformer (30) of a welding apparatus (2) for welding at least one workpiece (5, 6).The semiconductor module (41 to 44 401; 402) comprises a first printed circuit board (46; 46A; 46B), a second printed circuit board (47), and at least one semiconductor switching element (410) for switching an electric current (450; 455) greater than 10000 A, wherein the at least one semiconductor switching element (410) is electrically connected between the first and second printed circuit boards (46, 47) in such a way that an electric current (450; 455) switched by the at least one semiconductor switching element (410) can flow from the first printed circuit board (46; 46A; 46B) into the second printed circuit board (47) or from the second printed circuit board (47) into the first printed circuit board (46; 46A; 46B).