Power Semiconductor Module Internal PCB Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power semiconductor module arrangements are typically large and bulky due to protruding contact elements, which hinder compactness and efficiency in size and space utilization.
Innovation Solution
The arrangement includes a housing with a substrate and a first metallization layer, a dielectric insulation layer, and a first printed circuit board positioned inside the housing, where terminal elements with pressfit pins securely connect to the metallization layer and board, allowing for compact integration by eliminating the need for external printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact elements protrude through the housing cover, then electrical connectivity is achieved, but the module size increases and compactness deteriorates
Solution Approach 1:
The patent repositions the printed circuit board from an external location to an internal location within the housing, changing the spatial dimension of the connection architecture. This internal integration eliminates the need for protruding contact elements while maintaining electrical connectivity through the substrate's metallization layers, thereby reducing module volume without sacrificing reliability
Solution Approach 2:
The patent embeds the printed circuit board inside the housing cavity, nesting it within the existing structural boundaries. This nesting approach allows the circuit board to be housed within the same envelope as the substrate, eliminating external protrusions and achieving a compact integrated design while preserving all electrical connection functions
2Reliability
If an external printed circuit board is used, then electrical connections are established, but space utilization deteriorates and compactness is reduced
Solution Approach 1:
The patent merges the printed circuit board with the housing structure by positioning it inside the housing cavity, combining previously separate components (external PCB, housing, substrate) into an integrated assembly. This merging eliminates wasted space between components and achieves compact space utilization while maintaining reliable electrical connections through the substrate's metallization layers
Data Source
Figure 1~2
Figure 3~5
Figure 6A~8
AI summary
A power semiconductor module arrangement comprises a housing (7), a substrate (10) arranged inside the housing (7) and comprising a dielectric insulation layer (11), and a first metallization layer (111) arranged on a first side of the dielectric insulation layer (11), at least one semiconductor body (20) mounted on a first surface (101) of the first metallization layer (111) which faces away from the dielectric insulation layer (11), a first printed circuit board (81) arranged inside the housing (7) essentially in parallel to and vertically above the substrate (10), and a plurality of first terminal element (44) that is mechanically connected to the first metallization layer (111), wherein each of the plurality of first terminal elements (44) extends from the first metallization layer (111) in a vertical direction (y) perpendicular to the first surface (101) towards the first printed circuit board (81), wherein each of the plurality of first terminal elements (44) comprises a pressfit pin (46), the first printed circuit board (81) comprises a plurality of through holes (810), each of the plurality of pressfit pins (46) is arranged in one of the through holes (810), and the first printed circuit board (81) is held in a desired position with regard to the substrate (10) primarily by means of the plurality of first terminal elements (44) and the connections formed by the plurality pressfit pins (46).