Semiconductor Module Case Layout for Wider PCB Installation
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Solution Overview
Problem
Conventional semiconductor modules have a narrow area for installing circuit boards due to the placement of the circuit board between the pair of second potential terminals and the AC terminal.
Innovation Solution
The semiconductor module features a first and second circuit board installation region on the insulating resin case, partitioned by protrusions and recesses, allowing for a wider installation area and ensuring sufficient insulation distances through protrusions and recesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board is disposed between the pair of second potential terminals and the AC terminal, then the circuit board can be installed with sufficient insulation distance, but the area where the circuit board can be installed is narrow
Solution Approach 1:
The upper surface of the insulating resin case is divided into multiple installation regions: a first circuit board installation region and a second circuit board installation region. The first protrusion partitions the surface to create the second circuit board installation region, which includes portions between the first potential terminals and between the second potential terminals. This segmentation allows circuit boards to be installed in multiple areas while maintaining required insulation distances from high-potential terminals.
Solution Approach 2:
The invention expands the installation area by utilizing the two-dimensional surface of the insulating resin case more effectively. By creating multiple distinct installation regions (first and second circuit board installation regions) separated by protrusions, the available area is increased without compromising insulation requirements. The second circuit board installation region specifically utilizes space between terminal pairs that would otherwise be unavailable.
2Area of stationary object
If the second circuit board installation region includes portions between the first and second potential terminals, then the installation area is widened, but maintaining sufficient insulation distance becomes more difficult
Solution Approach 1:
The first protrusion acts as an intermediary physical barrier between the first circuit board installation region and the second circuit board installation region. This protrusion structure creates a physical separation that maintains the required insulation distance between high-potential terminals and circuit board areas, even while allowing the second installation region to extend into areas between terminal pairs.
3Reliability
If protrusions and recesses are added to partition the installation regions, then insulation distances are ensured, but the device complexity increases
Solution Approach 1:
The first protrusion and second protrusion serve multiple functions simultaneously: they act as physical barriers to maintain insulation distances, they partition the upper surface into distinct installation regions, and they provide structural reinforcement to the insulating resin case. By making these structural elements multi-functional, the design achieves reliable insulation without proportionally increasing complexity.
Data Source
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AI summary
A semiconductor module having a wide region where a circuit board can be installed is implemented. A first circuit board installation region 7 in which a circuit board for controlling a plurality of semiconductor chips using auxiliary terminals 6 can be installed and a second circuit board installation region 8 in which a circuit board protruding portion of a protruding and extending portion of the circuit board can be installed are provided on an upper surface of an insulating resin case 2 of the semiconductor module 1. The second circuit board installation region 8 has a shape including at least a portion of the region between the pair of first potential terminals 3, and at least a portion of the region between the pair of second potential terminals 4, and is a first recess 12 partitioned by a first protrusion 9 provided on the upper surface of the insulating resin case 2. The upper surface of the insulating resin case 2 has a second protrusion 10 provided between each of the pair of first potential terminals 3 on the high potential side and the first protrusion 9, and a second recess 13 formed between the first protrusion 9 and the second protrusion 10.