Power Semiconductor Module Thermal Decoupling via Segmented PCBs
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Solution Overview
Problem
Power semiconductor modules face challenges in protecting thermally sensitive components from excessive heating, and ensuring suitable signal levels and low-inductance designs for drive circuits connected to power semiconductors.
Innovation Solution
A power semiconductor arrangement that thermally decouples power semiconductors from sensitive components, using a semiconductor module with a controllable power semiconductor component and separate printed circuit boards for signal transmission and control, with low-inductance conductor tracks and flexible pin connections for efficient signal and current handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power semiconductors are placed close to thermally sensitive components for compact design, then device complexity is reduced, but thermally sensitive components are exposed to excessive heating
Solution Approach 1:
The patent divides the circuit board into multiple separate printed circuit boards (first PCB, second PCB, third PCB) that are spaced apart from each other. This segmentation allows thermally sensitive components to be placed on boards that are physically separated from the power semiconductor modules, thereby reducing thermal exposure while maintaining a compact overall structure through the use of pins to bridge the gaps.
2Temperature
If multiple separate printed circuit boards are used for thermal decoupling, then thermally sensitive components are protected from excessive heating, but device complexity increases
Solution Approach 1:
The patent introduces pins as intermediary elements that electrically connect the multiple printed circuit boards while maintaining physical separation. These pins serve as mediators that allow the circuit to function as a unified system despite the fragmented board structure, thereby reducing the complexity increase that would otherwise result from using multiple separate boards.
3Device complexity
If drive circuit is integrated with power semiconductor module, then electrical connections are simplified, but thermally sensitive components are exposed to high temperatures
Solution Approach 1:
The drive circuit is separated from the power semiconductor module and placed on a distinct printed circuit board (second PCB) that is spaced apart from the module housing. This segmentation protects the drive circuit and associated thermally sensitive components from excessive heat while maintaining electrical connections through conductor tracks and pins, thereby improving reliability without significantly increasing connection complexity.
4Temperature
If conductor tracks are made long to connect separate boards, then thermal decoupling is improved, but inductance increases
Solution Approach 1:
The patent transitions from planar conductor tracks to three-dimensional pin connections that extend vertically between stacked printed circuit boards. This dimensional change allows electrical connections to be made directly between boards without requiring long lateral traces, thereby maintaining low inductance while achieving thermal decoupling through vertical spacing between boards.
Data Source
AI summary
A power semiconductor module arrangement includes a semiconductor module having a controllable power semiconductor component, a first printed circuit board (PCB) arranged outside the semiconductor module, and a control unit arranged outside the semiconductor module and having a second PCB. The control unit is configured to control the controllable power semiconductor component. The controllable power semiconductor component has a first load terminal and a second load terminal between which a load path of the power semiconductor component is formed, and also a control terminal for controlling the load path. The first PCB has a conductor track connected in series with the load path. The first and second PCBs are spaced apart from one another and electrically connected to one another by a pin.