Semiconductor Module Pin-Clamped Substrates for Compact Packaging
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Solution Overview
Problem
Semiconductor modules, particularly power modules, require significant installation space due to the use of separate contacts (pins) for connecting semiconductor components to substrates, which limits their compactness.
Innovation Solution
A semiconductor module design where a pin is used for both electrical conductivity and non-positive locking connection between the semiconductor component and substrates, reducing the need for additional connecting means like screws, by employing a non-releasable connection method such as clamping or soldering, and utilizing substrates with metal coatings for enhanced electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If separate contacts (pins) are used for both electrical conductivity and mechanical connection, then the installation space is reduced, but the connection reliability may be compromised
Solution Approach 1:
The patent merges the electrical conduction function and mechanical connection function into a single pin structure. The pin simultaneously provides electrical conductivity between the semiconductor component and substrate, and mechanical support through non-positive locking connection, eliminating the need for separate contacts and reducing installation space.
Solution Approach 2:
The pin is designed as a multi-functional element that performs multiple roles: electrical conduction, mechanical support, and positioning. By making the pin universal in its functions, the patent reduces the number of components needed while maintaining connection reliability through the integrated design.
2Stability of the object's composition
If a non-releasable connection method is used, then the mechanical stability is improved, but the ease of repair is reduced
Solution Approach 1:
The pin is pre-designed with specific geometric features (such as enlarged heads or shaped sections) that enable non-positive locking connection during the assembly process. This preliminary design of the connection geometry allows the pin to automatically achieve stable mechanical connection when inserted, without requiring additional fastening operations or tools during assembly or repair.
3Device complexity
If the pin is used for both electrical and mechanical functions, then the device complexity is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The patent optimizes the pin's geometric parameters (such as diameter, length, head shape, and tolerance ranges) to achieve both electrical and mechanical functions. By carefully selecting and adjusting these parameters, the design balances the reduced device complexity with manageable manufacturing precision requirements, ensuring the pin can be produced with standard manufacturing tolerances while still achieving reliable non-positive locking connection and electrical conductivity.
Data Source
AI summary
A semiconductor module includes a housing, a pin arranged in the housing and including a first contact region which has a press-fit connection, a semiconductor component arranged in the housing and electrically conductively connected to the pin, and a first substrate arranged in the housing and clamped in the housing via the pin by a non-positive locking connection, which, when formed, causes the press-fit connection to be deformed elastically and/or plastically with the first substrate. The first substrate has a first recess which is open and at least in part encompasses the pin in the first contact region. A metallic coating is applied to the first substrate at least in a region of the first recess so as to electrically conductively connect the first substrate to the semiconductor component, and a second substrate is in contact with the pin and connected within the housing in a non-releasable manner.