Semiconductor Module Pin Connection Identification

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Solution Overview

Problem

Existing semiconductor modules lack an efficient method to identify the configuration of pin connections between module pins and device pins, which is crucial for testing and operation, leading to potential errors and inefficiencies.

Innovation Solution

A semiconductor module with a connection identification unit that generates and outputs a pattern signal through device pins to identify pin connections, utilizing a register block and control block to decode and control the pattern, allowing for effective configuration identification.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a semiconductor module includes interconnect circuitry to connect device pins to module pins, then the module enables functional connectivity between devices, but the configuration of pin connections becomes difficult to identify and test

Engineering Contradiction:
Improvepin connection identificationVSAvoidtesting complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-configuring identification circuits within the semiconductor device that automatically generate and output identification patterns through device pins. This preliminary setup enables the testing system to directly read pin connection configurations without complex manual testing procedures, thus improving reliability while reducing testing complexity.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces an intermediary identification pattern signal that mediates between the physical pin connections and the testing system. This intermediate representation allows the testing system to indirectly but efficiently determine pin configurations without directly probing each connection, reducing testing complexity while ensuring reliable identification.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If the semiconductor device outputs identification pattern signals through device pins, then pin connection configuration can be identified, but additional circuitry increases device complexity

Engineering Contradiction:
Improvepin connection identification accuracyVSAvoiddevice internal circuitry
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent applies universality by designing identification circuits that utilize existing device pins and internal resources for multiple purposes. The same pins and circuit elements used for normal device operation are also employed to generate and output identification patterns, thereby achieving precise pin connection identification without adding significant additional circuitry.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent implements self-service by enabling the semiconductor device to automatically generate and output its own identification patterns using its internal resources. The device serves itself by utilizing its own pins and logic to create identification signals, eliminating the need for external identification hardware and minimizing additional device complexity while maintaining high identification accuracy.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS9035670B2Semiconductor module, test system and method employing the same
Publication Date: 2015.05.19 SAMSUNG ELECTRONICS CO LTD
  • US9035670B2 patent drawing
  • US9035670B2 patent drawing
  • US9035670B2 patent drawing

AI summary

A semiconductor module includes a plurality of module pins and a semiconductor device. Module pins receive an identification pattern signal having M bits and outputs a test identification pattern, where M is a positive integer. The semiconductor device includes device pins, and outputs the identification pattern signal through the device pins in response to a connection identification control signal for identifying a configuration of pin connections between the module pins and the device pins. The semiconductor module effectively identifies a configuration of pin connections between the module pins and the device pins.