Semiconductor Module Pin Length Control via Slide Support

Solution Overview

Problem

Existing semiconductor module manufacturing methods fail to accurately control the length of pins protruding from the sealing resin, leading to potential bonding failures and reduced quality due to misalignment and length differences, especially in high-current applications.

Innovation Solution

A semiconductor module design featuring a block-shaped lower base member with a bottomed hole and a tubular upper slide support member, where the pin is slidably fitted and adjusted to a preset depth within the support member before being sealed with resin, ensuring precise alignment and length control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If pins are continuously cut from a long copper wire using conventional methods, then productivity is improved through continuous manufacturing, but manufacturing precision deteriorates due to length variations of 100-200 μm caused by jig position misalignment

Engineering Contradiction:

Improvecontinuous pin manufacturingVSAvoidpin length consistency

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The pin length is predetermined by the distance between the lower base member and the upper slide support member before the pin is inserted. This preliminary positioning ensures that all pins have consistent lengths regardless of when they are cut or inserted, eliminating the need for precise cutting alignment while maintaining continuous manufacturing capability

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The upper slide support member acts as an intermediary that provides a reference surface for pin length determination. By positioning the pin between the lower base member and the upper slide support member, the system transfers the precision requirement from the cutting process to the positioning of these support members, which can be more easily controlled

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If pin lengths are not accurately controlled, then ease of manufacture is improved by accepting natural length variations, but reliability deteriorates due to bonding failures between pins and connecting conductors

Engineering Contradiction:

Improveacceptance of length variationsVSAvoidbonding quality

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The pin length is predetermined by the distance between the lower base member and the upper slide support member before the pin is inserted. This preliminary positioning ensures that all pins have consistent lengths regardless of when they are cut or inserted, eliminating the need for precise cutting alignment while maintaining continuous manufacturing capability

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The upper slide support member acts as an intermediary that provides a reference surface for pin length determination. By positioning the pin between the lower base member and the upper slide support member, the system transfers the precision requirement from the cutting process to the positioning of these support members, which can be more easily controlled

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11037848B2Semiconductor module and semiconductor module manufacturing method

Publication Date: 2021.06.15 FUJI ELECTRIC CO LTD

AI summary

A semiconductor module includes block-shaped first and second lower base members provided by bonding of flat lower surfaces on an insulated circuit board and having bottomed first and second hole portions open in upper surfaces in upper portions of the first and second lower base members, tubular first and second upper slide support members inserted in the first and second hole portions in a state where at least a part of outside surfaces is in contact with inside walls of the first and second hole portions, first and second pins inserted in contact with the insides of the first and second upper slide support members, and a sealing resin sealing the first and second pins except for the upper portions of the first and second pins.