Power Semiconductor Module Pin Mounting Eliminates PCB Through Holes

Solution Overview

Problem

The existing power semiconductor modules require large or multi-layer printed circuit boards due to the need for through holes to accommodate screws, which increases costs and reduces usable area for conducting paths.

Innovation Solution

A power semiconductor module arrangement using pins or bolts instead of screws for mounting to a heat sink, where the pins or bolts are inserted through the housing and pressed into the heat sink using a pressing tool, eliminating the need for through holes in the printed circuit board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If screws are used to mount the housing to the heat sink, then secure mounting is achieved, but through holes are required in the printed circuit board which increases costs and reduces usable area

Engineering Contradiction:

Improvemounting securityVSAvoidprinted circuit board area

Core Design Contradiction:

StrengthVSArea of stationary object

Solution Approach 1:

The invention extracts the fastening function from the printed circuit board by using pins that are inserted through the housing and engaged with the heat sink, eliminating the need for through holes in the printed circuit board. This separates the mounting function (handled by pins and housing) from the electrical function (handled by the printed circuit board surface), thereby preserving the full area of the printed circuit board for conducting paths.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The housing acts as an intermediary element between the printed circuit board and the heat sink. The pins are inserted through the housing to engage with the heat sink, while the printed circuit board is mounted to the housing without requiring through holes. This intermediary approach allows secure mounting to the heat sink while maintaining the integrity and full area of the printed circuit board.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If through holes are provided in the printed circuit board for screw mounting, then secure attachment to heat sink is enabled, but manufacturing complexity and costs increase

Engineering Contradiction:

Improveattachment securityVSAvoidmanufacturing simplicity

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The invention extracts the fastening function from the printed circuit board by using pins that are inserted through the housing and engaged with the heat sink, eliminating the need for through holes in the printed circuit board. This separates the mounting function (handled by pins and housing) from the electrical function (handled by the printed circuit board surface), thereby preserving the full area of the printed circuit board for conducting paths.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The mounting function is segmented from the printed circuit board and assigned to the housing and pins. The pins are inserted through the housing to engage with the heat sink, while the printed circuit board is mounted to the housing without requiring through holes. This segmentation allows secure mounting to the heat sink while maintaining the integrity and full area of the printed circuit board.

Inventive Principle:

Principle #1Segmentation

3Strength

If larger printed circuit board or additional layers are used to compensate for through holes, then mounting capability is maintained, but overall costs increase

Engineering Contradiction:

Improvemounting capabilityVSAvoidmaterial usage

Core Design Contradiction:

StrengthVSQuantity of substance

Solution Approach 1:

The invention extracts the fastening function from the printed circuit board by using pins that are inserted through the housing and engaged with the heat sink, eliminating the need for through holes in the printed circuit board. This separates the mounting function (handled by pins and housing) from the electrical function (handled by the printed circuit board surface), thereby preserving the full area of the printed circuit board for conducting paths.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The housing serves multiple functions: it provides structural support, electrical insulation, and serves as the mounting interface for the pins to the heat sink. This multi-functionality eliminates the need for additional through holes in the printed circuit board, allowing the same printed circuit board to serve both electrical and mounting purposes without requiring extra material or layers.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12041755B2Power semiconductor module arrangement and method for producing a power semiconductor module arrangement

Publication Date: 2024.07.16 INFINEON TECHNOLOGIES AG

AI summary

A method for producing a power semiconductor module arrangement includes: arranging at least one semiconductor substrate in a housing, each semiconductor substrate including a first metallization layer attached to a dielectric insulation layer, the housing including a through hole extending through a component of the housing; inserting a fastener into the through hole such that an upper portion of the fastener is not inserted into the through hole; arranging a printed circuit board on the housing; arranging the housing on a mounting surface, the mounting surface comprising a hole, wherein the housing is arranged on the mounting surface such that the through hole is aligned with the hole in the mounting surface; and exerting a force on the printed circuit board such that the force causes the fastener to be pressed into the hole in the mounting surface so as to secure the housing to the mounting surface.