Semiconductor Module Plastic Casing Microwave Insulation
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Solution Overview
Problem
Current methods for creating semiconductor modules with microwave components in plastic casings face challenges in miniaturization, cost-effectiveness, and complexity, particularly in producing microwave insulation regions and integrating antenna structures, due to limitations in milling techniques and material properties.
Innovation Solution
The semiconductor module incorporates a multilayered conductor track structure with structured metal and insulation layers, including a microwave insulation region within the plastic package molding compound, which allows for the integration of antenna structures as an integral component, using a sacrificial material structure to create a coupling cavity with a relative dielectric constant of approximately 1, enabling efficient microwave insulation and antenna coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional milling techniques are used to create microwave insulation regions, then manufacturing precision can be achieved, but device complexity and production cost increase significantly
Solution Approach 1:
The patent extracts the harmful function of the plastic casing (which conducts microwave signals) by removing specific regions to create microwave insulation regions. This allows the plastic casing to simultaneously serve as structural support and microwave insulation, eliminating the need for separate insulation components and reducing production complexity
Solution Approach 2:
The patent applies local quality by creating specific microwave insulation regions with different properties from the surrounding plastic casing. The removed regions have a relative dielectric constant of approximately 1, while the remaining plastic casing maintains its original properties, allowing targeted microwave insulation where needed
2Volume of moving object
If antenna structures are integrated into the plastic casing, then miniaturization is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the antenna structure with the plastic casing by integrating the antenna into the casing's geometry. The plastic casing serves dual functions as both structural housing and antenna support, with microwave insulation regions created by removing plastic material. This integration achieves miniaturization while keeping manufacturing relatively simple
Solution Approach 2:
The plastic casing is designed to perform multiple functions simultaneously: structural support, electromagnetic shielding, and antenna support. The microwave insulation regions are created by selectively removing plastic material, allowing the same component to provide both mechanical and electromagnetic functions
3Reliability
If microwave insulation regions are created in the plastic casing, then antenna coupling efficiency improves, but production cost increases
Solution Approach 1:
The patent creates microwave insulation regions by removing plastic material from the casing, extracting the conducting portion while leaving the insulating plastic intact. This approach improves antenna coupling efficiency by providing proper microwave insulation without requiring additional expensive materials or complex manufacturing processes
Solution Approach 2:
The patent changes the dielectric parameter of the plastic casing by removing material to create regions with a relative dielectric constant of approximately 1. This parameter change improves microwave insulation and antenna coupling efficiency while maintaining compatibility with standard plastic molding processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the production of semiconductor modules with optimized antenna structures and microwave insulation, allowing for improved directionality and coupling efficiency, while reducing costs and complexity by using a plastic casing that can be tailored for various frequencies and antenna configurations.
Implementation Method 1
the microwave insulation region has a relative dielectric constant ∈r between 1≦∈r≦2.5
Implementation Method 2
a radiation plate (21) which is disposed in a third metal layer (15)
Data Source
AI summary
A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principal surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principal surface.