Semiconductor Module Layout for Heat Dissipation Plate Contact
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Solution Overview
Problem
Conventional semiconductor modules for power circuits in trains and industrial equipment face challenges in heat dissipation due to deformation of the heat dissipation plate, leading to gaps between the plate and the stationary board, which hinders effective heat transfer and electric current enhancement.
Innovation Solution
The semiconductor module is designed with a heat dissipation plate that is fixed at both ends using bolts to maintain contact with the stationary plate, and features a deformed shape with a convex center and inverted convex portions to ensure close contact, along with a case containing insulating substrates and semiconductor devices sealed with resin, reducing self-inductance and facilitating heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat dissipation plate is made rigid for stable heat dissipation, then heat dissipation ability is improved, but the plate deforms during production causing gaps with the stationary plate
Solution Approach 1:
The heat dissipation plate is designed with flexible portions that allow it to dynamically adapt its shape. The plate can deform during production to match the stationary plate's surface, ensuring full contact. This flexibility resolves the contradiction by allowing the plate to maintain both structural integrity for heat dissipation and adaptability for precise contact during manufacturing and operation.
Solution Approach 2:
The invention changes the physical parameters of the heat dissipation plate by introducing flexible portions with specific deformation characteristics. The plate is designed to deform within a controlled range (0-100μm) to achieve optimal contact with the stationary plate while maintaining sufficient rigidity for heat dissipation. This parameter adjustment resolves the contradiction between rigidity and adaptability.
2Manufacturing precision
If the heat dissipation plate is made flexible to adapt to the stationary plate, then contact precision is improved, but heat dissipation ability may be reduced
Solution Approach 1:
The heat dissipation plate incorporates flexible portions that provide dynamic adaptability. These portions can deform during production to achieve full contact with the stationary plate, ensuring high contact precision. The flexible design allows the plate to conform to surface irregularities while maintaining sufficient structural integrity to perform its heat dissipation function effectively.
Solution Approach 2:
The invention optimizes the flexibility parameters of the heat dissipation plate by controlling the degree and location of flexible portions. The plate is designed to deform within a specific range (0-100μm) to achieve optimal contact without compromising heat dissipation ability. This controlled parameter change resolves the contradiction between flexibility for contact precision and rigidity for heat dissipation.
3Volume of moving object
If the module size is reduced for compact design, then space efficiency is improved, but inspection accessibility of connection metal members deteriorates
Solution Approach 1:
The invention addresses the inspection accessibility issue by organizing connection metal members in different spatial dimensions and orientations. The conductive layers are arranged on both the upper and lower surfaces of the insulating substrate, allowing inspection from multiple angles. This multi-dimensional arrangement enables thorough inspection of all connection members within a compact module footprint, resolving the contradiction between small size and inspection accessibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation capabilities, allows for higher electric current transmission, and reduces the area required for current passage, while maintaining a compact module size and improving inspection accessibility of connection metal members.
Implementation Method 1
it is possible to appropriately transmit heat generated from the semiconductor device to the stationary plate
Data Source
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AI summary
The invention provides a semiconductor module comprising: an insulating substrate (100); a first element bonding conductor layer (43) and a second element bonding conductor layer (63); first semiconductor devices (Tr1) and second semiconductor devices (Tr2) respectively bonded to the first and second element bonding conductor layer (43, 63); and first wires (51) by which the first semiconductor devices (Tr1) and the second element bonding conductor layer (63) are connected together; wherein the first element bonding conductor layer (43) has a first part (43a) formed in a rectangular shape, and the second element bonding conductor layer (63) has a first part (63a) of the second element bonding conductor layer (63) formed in a rectangular shape, and a second part (63e) of the second element bonding conductor layer (63) disposed along one long side of the first part (43a) and to the first wires (51) are connected.