Semiconductor Module Plating and Roughening
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Solution Overview
Problem
Semiconductor modules face issues with solderability between the metal block and semiconductor device, as well as adhesion between the resin and metal block, due to oxidation and the formation of Kirkendall voids, leading to reliability concerns and increased manufacturing costs.
Innovation Solution
A semiconductor module design featuring a metal block with a plating area and roughened area, where the semiconductor device installation area is in the plating area, and the formation of concave portions in the plating area to enhance adhesion, reducing the need for expensive primers and improving solder wetability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the surface of the metal block is Ni plated to prevent oxidation and improve solderability, then solderability is improved, but adhesion between the Ni plating and resin deteriorates
Solution Approach 1:
The invention applies different surface treatments to different regions of the metal block: the semiconductor device installation area receives Ni plating for improved solderability, while the resin molding area is roughened to enhance adhesion. This local differentiation resolves the contradiction by optimizing each region for its specific function without compromising the other.
2Reliability
If the surface of the metal block is Ni plated to ensure solderability, then solderability is improved, but manufacturing cost increases due to the need for expensive primers
Solution Approach 1:
The invention limits Ni plating application to only the semiconductor device installation area where solderability is required, while using roughening treatment for the resin molding area. This selective application eliminates the need for expensive primers on the resin molding area, reducing manufacturing cost while maintaining necessary solderability.
Solution Approach 2:
The invention replaces the expensive primer coating with a roughened surface treatment on the resin molding area. The roughened surface provides sufficient adhesion for the resin without requiring additional expensive materials, thereby reducing manufacturing cost.
3Ease of manufacture
If the metal block surface is left untreated to reduce manufacturing cost, then manufacturing cost is reduced, but oxidation occurs leading to poor solderability
Solution Approach 1:
The invention applies Ni plating selectively only to the semiconductor device installation area where solderability is required, rather than treating the entire metal block surface. This localized treatment reduces manufacturing cost by eliminating unnecessary plating on the resin molding area while maintaining solderability where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures reliable solderability and adhesion between the metal block and semiconductor device, while reducing manufacturing costs by eliminating the need for expensive primers and preventing Kirkendall voids, thereby enhancing the overall reliability and efficiency of the semiconductor module.
Implementation Method 1
since the area on which the semiconductor device is installed is not subject to surface treatment such as plating, it is easily oxidized
Implementation Method 2
the surface of the metal block includes a plating area and a roughened area
Implementation Method 3
if the metal block is pure Cu, CuSn is formed as an intermetallic compound at the time of soldering
Data Source
AI summary
A semiconductor module comprises: a metal block; a semiconductor device installed via a solder layer in a semiconductor device installation area on a surface of the metal block; and a molded portion formed by molding a resin on the metal block and the semiconductor device; wherein the surface of the metal block includes a plating area and a roughened area, and the semiconductor device installation area is provided in the plating area.