Power Semiconductor Module Press-Fit Terminal Mounting
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Solution Overview
Problem
Power semiconductor module arrangements face challenges in easily mounting terminal elements and compensating for tolerances and varying substrate thicknesses, which can lead to improper contact and potential damage during the mounting process.
Innovation Solution
A mounting arrangement with a frame or body that couples to the housing, ensuring mechanical and electrical contact between terminal elements and the semiconductor substrate, with a design that adjusts to accommodate different substrate thicknesses by altering the insertion depth of the mounting arrangement within the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If terminal elements are mounted using traditional soldering or sintering techniques, then electrical connection is achieved, but the mounting process becomes complex and sensitive to substrate thickness variations
Solution Approach 1:
The patent replaces traditional mechanical mounting methods (soldering, sintering) with a press-fit mechanical connection system. The terminal element includes a press-fit portion that mechanically engages with the semiconductor substrate through insertion and pressing, eliminating the need for thermal processing and complex alignment procedures while maintaining reliable electrical connection.
Solution Approach 2:
The patent employs a press-fit portion with specific dimensional parameters (length, cross-sectional shape) that can be adjusted to accommodate varying substrate thicknesses. By changing the insertion depth and pressing force parameters, the system adapts to different substrate conditions without requiring modifications to the mounting process itself.
2Ease of manufacture
If terminal elements are mounted with fixed length, then manufacturing is simplified, but tolerance compensation for varying substrate thicknesses becomes difficult
Solution Approach 1:
The press-fit portion is designed with dynamic insertion characteristics where the insertion depth is not fixed but adapts based on the substrate thickness. The pressing operation allows the terminal element to achieve proper contact depth automatically, compensating for substrate thickness variations while maintaining consistent electrical connection quality.
3Reliability
If pressing force is applied during mounting, then mechanical contact is ensured, but risk of substrate damage increases
Solution Approach 1:
The press-fit portion is designed with appropriate length and structural characteristics that allow controlled pressing force application. The design incorporates cushioning effects through the pressing mechanism that distributes force evenly, preventing localized stress concentrations that could damage the substrate while ensuring reliable mechanical contact.
Data Source
AI summary
A power semiconductor module arrangement includes a semiconductor substrate arranged in a housing, and a mounting arrangement including a frame or body, and at least one terminal element coupled to the frame or body. The mounting arrangement is inserted in and coupled to the housing. The mounting arrangement has a lower surface which, when the mounting arrangement is inserted in and coupled to the housing, rests on at least one contact surface of the housing. When the mounting arrangement is inserted in and coupled to the housing, the at least one terminal element mechanically and electrically contacts the semiconductor substrate with a first end, and a distance between an upper surface of the semiconductor substrate and the at least one contact surface in a vertical direction equals a length of the first end between the upper surface of the semiconductor substrate and the lower surface of the mounting arrangement.