Semiconductor Module Housing With Press-Fit Pin Substrate Mounting
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Solution Overview
Problem
Semiconductor modules, particularly power modules, face challenges in compactness due to the requirement for separate contacts (pins) that occupy installation space, necessitating a more efficient method for connecting substrates within the housing.
Innovation Solution
A semiconductor module design that uses a pin for electrically conductive contact between substrates, where the pin is permanently connected within the housing through a non-positive clamping mechanism, allowing the first substrate to be force-fittingly connected via a metallic-coated recess, eliminating the need for additional connecting means and saving space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate pins are used for electrical contact between substrates, then electrical connection is achieved, but installation space is increased
Solution Approach 1:
The patent combines the electrical contact function and mechanical mounting function into a single integrated pin structure. The pin serves dual purposes: providing electrical connection between substrates and acting as a mounting element for securing the first substrate to the housing, thereby eliminating the need for separate mounting components and reducing installation space.
Solution Approach 2:
The pin is designed as a multi-functional component that simultaneously performs electrical conduction and mechanical fastening. By making the pin universal for both electrical and mechanical purposes, the patent reduces the total number of components required and optimizes the use of installation space within the housing.
2Stability of the object's composition
If additional connecting means are used for substrate mounting, then mechanical stability is improved, but device complexity increases
Solution Approach 1:
The patent merges the mounting function into the existing pin structure used for electrical contact. The first substrate is directly mounted to the housing via the same pin that provides electrical connection, eliminating the need for separate mounting brackets, screws, or adhesives, thereby simplifying the overall assembly structure while maintaining mechanical stability.
Solution Approach 2:
The pin is designed to universally serve both electrical and mechanical functions. This multi-functionality reduces device complexity by consolidating multiple components into a single element, making the assembly process simpler and the overall structure less complex.
3Reliability
If multiple separate components are used for connection, then connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple separate components (electrical contact pin and mounting element) into a single integrated pin. This reduction in component count directly lowers manufacturing costs by reducing material usage, assembly steps, and quality control requirements, while the integrated design maintains connection reliability through its dual-function capability.
Solution Approach 2:
The universal pin design that performs both electrical and mechanical functions reduces the total number of parts that need to be manufactured, sourced, and assembled. This multi-functionality leads to cost savings in manufacturing while maintaining the reliability needed for both electrical connection and mechanical support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a more compact semiconductor module by eliminating the need for screws and additional pins, simplifying the assembly process while ensuring a mechanically stable and electrically conductive connection between substrates and the semiconductor component.
Implementation Method 1
the first substrate has a metallic coating at least in the area of the first recess, such that the first substrate is electrically conductively connected to the semiconductor device
Implementation Method 2
the pin has a press-fit connection in the first contact area, which is elastically and/or plastically deformed during the formation of the force-fit connection with the first substrate
Implementation Method 3
the pin has a press-fit connection in the first contact area, which is elastically and/or plastically deformed during the formation of the force-fit connection with the first substrate
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to a semiconductor module (2) comprising a housing (4), at least one semiconductor component (10), a first substrate (18) and a second substrate (30). In order to provide a semiconductor module (2), which is more compact in comparison to the prior art, it is proposed that at least the semiconductor component (10) and the first substrate (18) are arranged in the housing (4), wherein the semiconductor component (10) is electrically conductively connected to at least one pin (14), wherein the at least one pin (14) is in contact with the second substrate (18) and is non-detachably connected within the housing (4), wherein the first substrate (18) is force-lockingly connected in the housing (4) via the at least one pin (14).