Semiconductor Module Press-Fit Terminals for Compact High-Current Connections
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Solution Overview
Problem
The existing semiconductor modules require a large number of input-output terminals to accommodate high current flow, making downsizing difficult due to the need for sufficient space, and existing terminal configurations are not efficient for secure and compact connections.
Innovation Solution
The semiconductor module incorporates press-fit terminals with a plate-shaped conductive part and elastic parts that separate in the thickness direction, allowing for secure and efficient electrical connections with reduced terminal count, enabling better conducting performance and downsizing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a predetermined number of input-output terminals is used to allow large current flow, then current handling capability is improved, but device size increases making downsizing difficult
Solution Approach 1:
The patent transitions from traditional pin-shaped terminals extending vertically to plate-shaped terminals with elastic parts that extend horizontally and make contact from the side. This dimensional change allows for more efficient current distribution and reduced terminal count while maintaining current handling capability
Solution Approach 2:
The patent changes the physical parameters of the terminals by introducing elastic parts with specific thickness ratios (0.05-0.5 times the plate width) and material properties (elastic modulus between 10-100 GPa). These parameter changes enable secure electrical contact with fewer terminals, reducing the overall module size while maintaining adequate current flow capacity
2Reliability
If traditional pin-shaped terminals are used, then manufacturing is simple, but connection reliability is insufficient for secure electrical contact
Solution Approach 1:
The patent introduces elastic parts into the terminal structure that can dynamically adapt to contact surfaces. These elastic parts deform under contact pressure to ensure reliable electrical connection, providing self-adjusting contact pressure without requiring complex adjustment mechanisms
Solution Approach 2:
The terminal structure combines rigid plate components with elastic components, creating a composite structure that provides both structural stability and contact adaptability. This composite approach achieves secure electrical contact while maintaining manufacturing feasibility through standard metalworking processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for stable and secure connections with fewer terminals, reducing the space required and improving conducting performance, enabling smaller module sizes while maintaining high current handling capabilities.
Implementation Method 1
at least one of the plate surfaces thereof having elasticity, to thereby form an elastic part of the press-fit part
Data Source
AI summary
A semiconductor module, including a plurality of semiconductor elements, each of which has a main electrode and a control electrode, an enclosure that encloses the plurality of semiconductor elements, a plurality of first connection terminals, each of which is electrically connected to the control electrode of one of the semiconductor elements and extends from the enclosure, and a plurality of second connection terminals, each of which is electrically connected to the main electrode of one of the semiconductor elements and extends from the enclosure. Each of the second connection terminals includes a press-fit part formed in substantially a plate shape having two plate surfaces. For a portion of the press-fit part, the two plate surfaces thereof are separated from each other in a thickness direction of the press-fit part, at least one of the plate surfaces thereof having elasticity, to thereby form an elastic part of the press-fit part.