Power Semiconductor Module Press-On Element Warpage Compensation
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Solution Overview
Problem
Power semiconductor modules face challenges with heat dissipation due to warpage, which reduces efficiency and is not effectively addressed by existing designs that either compromise on flexibility or increase manufacturing complexity, and are not suitable for all types of modules.
Innovation Solution
A power semiconductor module design featuring a separate press-on element with rail and limiting portions that allows for flexible mounting and self-locking mechanisms, enabling stable contact with a heat sink element while preventing warpage and simplifying manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power semiconductor module uses a rigid contact design with screws or bolts to fix the housing to the heat sink element, then the contact stability is improved, but the design becomes prone to aging at stressed positions and is less reliable in vibrating environments
Solution Approach 1:
The housing is divided into two separately manufactured parts: the main housing body and the press-on element. The press-on element is inserted into a rail portion of the housing and can be independently replaced, allowing the flexible press-on element to maintain contact with the heat sink while the main housing remains stable, thus resolving the contradiction between contact stability and flexibility
Solution Approach 2:
The press-on element is designed to be movable relative to the housing along the rail portion, enabling dynamic adjustment to accommodate warpage and maintain optimal contact pressure with the heat sink element during operation, thereby providing both stability and adaptability
2Adaptability or versatility
If the power semiconductor module uses a press-on element molded into the housing with through holes for screws, then the contact flexibility is improved, but the manufacturing process becomes complicated and manufacturing cost increases
Solution Approach 1:
The press-on element is manufactured separately from the housing through injection molding, then inserted into the housing's rail portion. This separate manufacturing approach simplifies the housing mold design while maintaining the flexibility benefits of the press-on element, reducing overall manufacturing complexity and cost
Solution Approach 2:
The rail portion structure serves multiple functions: guiding the press-on element insertion, providing lateral constraint, and enabling the press-on element to perform both pressing and limiting functions. This multi-functionality reduces the need for additional complex structures
3Stability of the object's composition
If the power semiconductor module uses flanges with through holes for screw fixation, then the structural stability is improved, but the module size increases and is not suitable for plastic encapsulated modules
Solution Approach 1:
Instead of adding lateral flanges that increase module footprint, the pressing and limiting functions are achieved through vertical insertion of the press-on element into the rail portion and engagement with limiting portions. This dimensional approach maintains structural stability without increasing module size
4Ease of manufacture
If the power semiconductor module allows warpage during operation, then the manufacturing simplicity is maintained, but the heat dissipation efficiency decreases due to increased gap and thicker heat conductive silicone grease
Solution Approach 1:
The press-on element applies preliminary pressing force to the heat-dissipation contact area before operation, and the limiting portions prevent excessive warpage during operation. This preliminary anti-action maintains good thermal contact between the module and heat sink, preserving heat dissipation efficiency while maintaining manufacturing simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation efficiency, extends service life, reduces production complexity, and allows for smaller module size, making it suitable for various packaging and transportation processes.
Implementation Method 1
heat conductive silicone grease at the bottom of the module directly contact with a heat sink element to dissipate heat generated by a semiconductor chip
Implementation Method 2
press the heat-dissipation contact area against the heat sink element to improve the heat dissipation efficiency
Implementation Method 3
rail cooperating portion is capable of being inserted into the rail portion and sliding in the rail portion
Implementation Method 4
first limiting portion is capable of cooperating with the first limiting cooperating portion to prevent the press-on element from moving relative to the housing in a direction toward the plane where the heat-dissipation contact area is located
Data Source
AI summary
The disclosure provides power semiconductor modules and their assembling methods. The module includes a heat-dissipation contact area, a housing and a press-on element. One of the housing and the press-on element includes a rail portion, while the other includes a rail cooperating portion. The housing and the press-on element respectively includes a first limiting portion and a first limiting cooperating portion. The rail cooperating portion can be inserted into the rail portion and slides on the rail portion in the direction toward or away from the plane where the heat-dissipation contact area is located, so that the press-on element could move from the separation position to the mounted position connected with the housing. The rail portion can cooperate with the rail cooperating portion to prevent the press-on element from moving relative to the housing in the direction parallel to the plane where the heat-dissipation contact area is located.