Semiconductor Module Pressing Member for Heat Dissipation

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Solution Overview

Problem

Conventional semiconductor devices fixed to cooling heat sinks using screws often experience insufficient pressure at the center, leading to inadequate heat radiation due to insufficient adhesion, resulting in inefficient heat dissipation.

Innovation Solution

A semiconductor device design featuring a semiconductor module with multiple switching elements and a molded member, pressed onto a heat radiation member using a pressing member, ensuring a pressure greater than or equal to a predetermined level for effective heat release, and a driving apparatus incorporating this semiconductor device with a motor and control unit for efficient heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If semiconductor devices are fixed to cooling heat sinks using screws at longitudinal end portions, then the device can be securely mounted, but the pressure at the center portion becomes insufficient leading to inadequate heat radiation

Engineering Contradiction:

Improvemounting securityVSAvoidheat radiation efficiency

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The pressing member is divided into multiple pressing portions (first pressing portion and second pressing portion) that can independently apply pressure to different regions of the semiconductor device. This segmentation allows simultaneous optimization of mounting security at end portions and heat radiation at the center portion by distributing pressing forces to multiple locations rather than using a single screw fixation point

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the semiconductor device receive different pressing forces tailored to their specific needs: the first pressing portion applies pressure to the center region where heat radiation efficiency is critical, while the second pressing portion applies pressure to the end portions where mounting security is critical. This localized quality approach ensures each region gets the appropriate pressure level for its function

Inventive Principle:

Principle #3Local quality

2Temperature

If multiple pressing members are used to improve heat radiation, then heat dissipation efficiency improves, but device complexity and number of components increase

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidnumber of pressing members

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

Multiple pressing functions are merged into a single integrated pressing member that contains both the first pressing portion and the second pressing portion. This unified structure achieves the heat radiation improvement benefits of multiple pressing points while avoiding the complexity and component count increase that would result from using separate pressing members for each function

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The pressing member serves multiple functions simultaneously: it provides mounting security through the second pressing portion at the end portions, improves heat radiation through the first pressing portion at the center region, and maintains structural integrity as a unified component. This multi-functionality eliminates the need for separate components for each function

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The semiconductor device efficiently releases heat generated from switching elements to the heat radiation member, improving adhesion and reducing the number of pressing members required, thus enhancing heat dissipation and reducing device dimensions.

Implementation Method 1

heat generated from the switching elements is releasable from the semiconductor module to the heat radiation member

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

heat radiation member

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS8680726B2Semiconductor device and driving apparatus including semiconductor device

Publication Date: 2014.03.25 DENSO CORP

AI summary

A semiconductor device includes a semiconductor module and a pressing member configured to press the semiconductor module to a heat radiation member. The semiconductor module includes switching elements, conductors, and a molded member. Each of the switching elements is mounted on a corresponding one of the conductors. The molded member covers the switching elements and the conductors. More than three of the switching elements are disposed around the pressing member. The switching elements are disposed in a region in which a pressure generated between the semiconductor module and the heat radiation member by pressing with the pressing member is greater than or equal to a predetermined pressure with which heat generated from the switching elements is releasable from the semiconductor module to the heat radiation member.