Semiconductor Module Pressure Compensation via Insulating Fluid
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Solution Overview
Problem
Current offshore oil and gas exploration technologies face challenges in deep-sea environments due to increased water pressure, which damages semiconductor chips and sealants in power electronic converters, leading to difficulties in installation and sealing of containers.
Innovation Solution
A semiconductor module package with electrically conductive top and base plates, semiconductor chips, power supply connecting plates, and an insulating outer casing filled with insulating fluid, which compensates for pressure differentials and temperature changes by adjusting the volume of the fluid to maintain internal and external pressure equilibrium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If the thickness of the container wall is increased to withstand increased water pressure at greater depths, then the container can withstand higher external pressure, but the volume and weight of the container increase enormously, making installation difficult
Solution Approach 1:
The invention divides the container into an inner pressure-resistant container and an outer protective container, with the semiconductor device placed in the inner container. This segmentation allows the critical semiconductor components to be isolated in a smaller, optimized pressure chamber rather than requiring the entire large container to be thick-walled, thereby reducing overall weight while maintaining pressure resistance.
Solution Approach 2:
The inner pressure-resistant container is nested within the outer protective container, forming a nested structure. The inner container with thicker walls withstands the water pressure, while the outer container provides additional protection and structural support. This nested arrangement optimizes weight distribution and allows the critical pressure-withstanding function to be concentrated in the inner container rather than distributed throughout the entire structure.
2Stress or pressure
If the container wall thickness is increased to withstand higher water pressure, then the container can operate at greater depths, but the volume of the container increases enormously
Solution Approach 1:
By segmenting the container into inner and outer portions, the volume increase is confined to the outer protective container while the inner pressure-resistant container maintains optimized dimensions. This allows the system to withstand higher pressures without proportionally increasing the total volume, as the critical pressure-withstanding function is localized to the inner container.
Solution Approach 2:
The nested structure allows the inner container to maintain its optimized volume for pressure resistance while the outer container provides additional protection. The inner container's volume is minimized for its pressure-withstanding function, and the outer container adds volume only where needed for structural support and protection, rather than requiring uniform thickness throughout.
3Reliability
If sealant is used to seal the container to isolate power electronic converters from the undersea environment, then the container can be sealed, but the increased pressure differential at greater depths damages the sealant
Solution Approach 1:
The invention introduces a cushioning layer between the inner and outer containers that compensates for the pressure differential. This cushioning structure is designed in advance to accommodate the pressure differences encountered at various depths, protecting the sealant from excessive stress and maintaining sealing reliability throughout the operating depth range.
Solution Approach 2:
The cushioning layer between the inner and outer containers acts as a flexible element that can deform to accommodate pressure differential changes. This flexible structure absorbs the stress that would otherwise be transmitted to the sealant, allowing the seal to maintain its integrity under varying pressure conditions without requiring the sealant itself to withstand the full pressure differential.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents damage from excessive pressure and temperature fluctuations, ensuring the semiconductor module's integrity and facilitating safer, more efficient deep-sea operations by maintaining internal and external pressure balance and managing thermal expansion.
Implementation Method 1
the volume of the insulating fluid is changed to compensate for the change in volume of the insulating fluid when there is a pressure differential between an external pressure and an internal pressure
Implementation Method 2
the volume of the insulating fluid is changed to compensate for the change in volume of the insulating fluid when there is a change in temperature
Data Source
AI summary
A semiconductor module comprising a plurality of electrically conductive top plates, an electrically conductive base plate, a plurality of semiconductor chips installed on the base plate, a first power supply connected to the plates, a second power supply connected to the plates and an electrically insulating outer casing component. The semiconductor chips are individually in contact with the top plates. Each semiconductor chip comprises a first electrode electrically coupled with the base plate, and a second electrical pole electrically coupled with the corresponding top plate. The first power supply connecting plate is equipped with protruding parts that are individually in electrical contact with the top plates. The second power supply connecting plate is electrically connected to the base plate. The outer casing component is used to integrate the first power supply connecting plate and the second power supply connecting plate. The outer casing component comprises at least one opening.