Semiconductor Module Assembly With Pseudo Coaxial Thermal Path
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Solution Overview
Problem
The existing semiconductor modules with MMICs mounted on silicon interposers using flip-chip technology suffer from poor heat dissipation due to the lack of effective thermal management.
Innovation Solution
A semiconductor module design that includes a semiconductor element mounted on an interposer substrate with a heat dissipation plate in close contact, utilizing a pseudo coaxial line configuration and conductive adhesives for improved thermal conductivity, allowing the semiconductor element's back face to be in close contact with the heat dissipation plate for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flip-chip mounting is used to mount MMICs on silicon interposer, then electrical connection is improved, but heat dissipation property deteriorates
Solution Approach 1:
The patent introduces a heat dissipation plate as an intermediary component between the semiconductor element and the interposer substrate. The back face of the semiconductor element is in close contact with the heat dissipation plate, which serves as a thermal mediator to conduct heat away from the semiconductor element, thereby resolving the heat dissipation problem while maintaining the electrical connection benefits of flip-chip mounting.
2Ease of manufacture
If semiconductor element is mounted on interposer substrate with conventional method, then assembly is simplified, but thermal resistance increases
Solution Approach 1:
The patent merges the heat dissipation function with the mounting structure by integrating the heat dissipation plate directly into the assembly. The semiconductor element is mounted with its back face in close contact with the heat dissipation plate, combining the mechanical support function with thermal management in a single integrated solution, thus maintaining assembly simplicity while reducing thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves heat dissipation efficiency by ensuring the semiconductor element's back face is in close contact with the heat dissipation plate, reducing thermal resistance and enabling efficient heat dissipation.
Implementation Method 1
a semiconductor-element signal pad electrically connected to the signal terminal of the semiconductor element by a conductive adhesive
Implementation Method 2
a heat dissipation plate having a front face in close contact with a back face of the semiconductor element
Data Source
AI summary
A semiconductor module includes: a semiconductor element having, on a front face thereof, a signal terminal and a ground terminal; a transmission line body having a signal transmission portion and a ground portion; a signal connection terminal electrically connected to the signal transmission portion of the transmission line body; ground connection terminals arranged to surround the signal connection terminal and electrically connected to the ground portion of the transmission line body, the ground connection terminals and the signal connection terminal constituting a pseudo coaxial line; a heat dissipation plate having a front face in close contact with a back face of the semiconductor element; and an interposer substrate having a semiconductor-element signal pad electrically connected to the signal terminal of the semiconductor element by a conductive adhesive, a transmission-line-body-2 signal pad electrically connected to the signal connection terminal, and a ground portion electrically connected to the ground connection terminals.