Semiconductor Module Reinforcing Board Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor modules face challenges in achieving efficient heat radiation, high yield rates, and cost-effective assembly due to the use of heat-radiating grease as a heat resistance component, which increases temperature and reduces current capacity, and the inefficiencies in solder-bonding processes, leading to potential bonding defects and increased costs.
Innovation Solution
A semiconductor module design that integrates a semiconductor element with an insulating circuit board, a first metal member, and a second metal member, where the second metal member is partially exposed and bonded to the cooler using a lead-free bonding material, enhancing heat radiation and mechanical strength, and incorporating a reinforcing metal board to improve bonding and reduce stress distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If heat-radiating grease is used to bond the metal substrate to the cooler, then assembly is simplified, but heat radiation performance deteriorates due to high heat resistance
Solution Approach 1:
The patent removes the heat-radiating grease layer from the bonding interface between the metal substrate and cooler. By eliminating this high heat resistance component, the thermal path is direct and efficient, solving the heat radiation performance issue while maintaining assembly simplicity through direct metal-to-metal contact.
Solution Approach 2:
The patent introduces a solder material as an intermediary bonding agent between the metal substrate and cooler. This solder provides both mechanical bonding and thermal conduction functions, replacing the dual role of grease (bonding + thermal interface) with a material that maintains assembly ease while dramatically improving heat transfer.
2Reliability
If a thick metal substrate is used to improve heat radiation, then heat conduction improves, but device weight and size increase
Solution Approach 1:
The patent changes the thickness parameter of the metal substrate to an optimized value that provides sufficient thermal conduction without excessive weight. By precisely controlling substrate thickness and selecting appropriate metal materials with high thermal conductivity, the design achieves effective heat radiation with minimized weight and size.
Solution Approach 2:
The patent employs composite material structures combining metal substrates with high thermal conductivity and appropriate mechanical properties. This allows achieving excellent heat conduction performance while controlling weight through material selection and structural optimization.
3Reliability
If solder-bonding is used to directly bond the insulating circuit board to the cooler, then heat radiation improves, but manufacturing complexity increases due to high temperature requirements
Solution Approach 1:
The patent segments the bonding process into two distinct stages: first bonding the insulating circuit board to the metal substrate at lower temperatures, then bonding the metal substrate to the cooler using solder material. This segmentation allows each bonding operation to be optimized independently, reducing overall manufacturing complexity while maintaining excellent heat radiation performance.
Solution Approach 2:
The patent performs preliminary bonding of the insulating circuit board to the metal substrate before final assembly with the cooler. This preliminary action prepares the structure for subsequent cooler bonding, allowing temperature-sensitive components to be protected during the high-temperature soldering process while ensuring proper thermal contact.
4Volume of moving object
If the semiconductor module unit is made compact to reduce size, then space efficiency improves, but heat radiation efficiency deteriorates
Solution Approach 1:
The patent optimizes geometric parameters including substrate thickness, cooler contact area, and thermal path length to achieve compact module dimensions while maintaining efficient heat radiation. By carefully controlling these parameters, the design achieves high heat transfer efficiency in a compact form factor.
Solution Approach 2:
The patent enhances heat radiation efficiency in the compact structure by utilizing three-dimensional thermal pathways and optimizing the spatial arrangement of heat-generating components, thermal conduction paths, and cooling interfaces. This dimensional optimization allows efficient heat dissipation without increasing overall module volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design results in a semiconductor module that is smaller, lighter, with improved heat radiation performance, higher yield rates, and easier assembly, while reducing stress distortion and extending the life of the solder bonding portion, thus addressing the inefficiencies of conventional methods.
Implementation Method 1
a lead-free bonding material, enhancing heat radiation and mechanical strength
Implementation Method 2
an insulating circuit board in which a plurality of power semiconductor chips which is a heat generation source is solder-bonded is solder-bonded to a metal substrate of copper or the like having an excellent heat conducting property
Implementation Method 3
the rear surface of the metal substrate is close-contacted with the cooler with heat-radiating grease interposed and is fixed to the cooler
Data Source
AI summary
A semiconductor module includes a semiconductor chip; an insulating circuit board that has on one of principal surfaces of an insulating substrate a circuit member electrically connected to the semiconductor chip, and a first metal member disposed in the other principal surface of the insulating substrate; a second metal member that is disposed on a side of an outer edge of the first metal member and is at least partially disposed further toward an outer side than the insulating substrate; a molding resin portion that seals the semiconductor chip, the insulating circuit board, and the second metal member such that a portion of the first metal member and a portion of the second metal member are exposed; a cooler; a first bonding member that bonds the cooler and the first metal member; and a second bonding member that bonds the cooler and the second metal member.