Semiconductor Module Heat Dissipation via Relay Electrode
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Solution Overview
Problem
Conventional semiconductor modules face challenges in effectively controlling heat conducted to external printed circuit boards via external lead terminals, leading to temperature increases that can exceed the heat resistance of components within power converters, necessitating a solution that manages heat without increasing the dimensions or cost of the power converter.
Innovation Solution
A semiconductor module design featuring a metal block with ceramic insulation layers for heat radiation and a relay electrode, where the bonding wire or lead frame from the circuit element is bonded to the relay electrode, allowing heat to be efficiently conducted to the metal block with high heat capacity and superior heat radiation performance, thereby controlling the amount of heat transferred to the external lead terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wire directly connects circuit element to external lead terminal, then electrical connection is achieved, but heat is conducted to external lead terminal heating the printed circuit board
Solution Approach 1:
The patent introduces a relay electrode as an intermediary component between the bonding wire and the external lead terminal. This relay electrode is connected to the circuit element via bonding wire and to the external lead terminal via another bonding wire, creating an intermediate connection point that redirects heat flow away from the external lead terminal and printed circuit board.
2Temperature
If heat radiation insulation layer is added to metal block, then heat radiation performance is improved, but device complexity increases
Solution Approach 1:
The patent changes the thermal parameters of the metal block by forming a heat radiation insulation layer on its surface. This layer has specific thermal conductivity properties that control heat flow, allowing the metal block to radiate heat more effectively while maintaining structural simplicity through a single-layer configuration.
3Temperature
If ceramic insulation layer is deposited on metal block, then heat conduction control is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces traditional mechanical insulation methods with a deposited ceramic insulation layer formed through vapor deposition or spraying processes. This substitution allows for precise control of heat conduction properties while simplifying the manufacturing process compared to mechanical assembly of insulation components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively manages heat transfer, reducing the heating of external printed circuit boards and maintaining the compactness and cost-effectiveness of power converters by utilizing ceramic insulation layers and a relay electrode for efficient heat dissipation.
Implementation Method 1
heat generated when the circuit element is operating is conducted to the metal block having a superb heat radiation performance via the relay electrode and the insulation layer for the relay electrode
Implementation Method 2
the metal block having a superb heat radiation performance
Implementation Method 3
formed by directly depositing a ceramic material on at least the first surface of the metal block
Implementation Method 4
formed by directly depositing a ceramic material on at least the first surface of the metal block
Data Source
AI summary
A semiconductor module includes: a metal block; an insulation layer for heat radiation formed by directly depositing a ceramic material on at least a first surface of the metal block; an insulation layer for a relay electrode formed by directly depositing a ceramic material on a part of a second surface 1b of the metal block; a relay electrode formed by depositing a metal material on the upper surface of the insulation layer for the relay electrode; a circuit element bonded with the second surface of the metal block by solder; and an external lead terminal, wherein a bonding wire or a lead frame from the circuit element is bonded with the relay electrode, and the relay electrode and the external lead terminal are connected.