Semiconductor Module Resin-Filled Through Hole Design
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Solution Overview
Problem
In semiconductor modules using press-fit terminals, excessive dimensional differences between the terminal and the circuit board can lead to excessive load on the board, causing deformation and potential cracking over time.
Innovation Solution
A semiconductor module design that includes a circuit board with a press-fit terminal and a resin portion on both sides, where the resin is filled in the through holes to provide additional support and reduce deformation by distributing the load effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the dimensional difference between the press-fit terminal and the through hole is increased to ensure proper connection, then the electrical connection reliability is improved, but the load on the circuit board becomes excessive causing deformation and potential cracking
Solution Approach 1:
The patent introduces a resin portion as an intermediary material that fills the through hole and surrounds the press-fit terminal. This resin mediator distributes the mechanical load from the terminal across a larger area of the circuit board, reducing stress concentration while maintaining electrical connectivity. The resin acts as a buffer that allows the terminal to maintain its dimensional difference for reliable connection without transmitting excessive point loads to the board.
Solution Approach 2:
The patent creates a composite structure by combining the press-fit terminal, resin portion, and circuit board into an integrated assembly. The resin portion bonds the terminal to the board while providing mechanical support and stress distribution. This composite approach allows the system to benefit from both the electrical connectivity of the terminal and the structural support of the resin-board combination, resolving the contradiction between connection reliability and board strength.
2Ease of operation
If the press-fit terminal is used for signal input and output, then the ease of operation is improved, but the circuit board may deform due to excessive load during press-fitting or with time after press-fitting
Solution Approach 1:
The resin portion is introduced as a pre-cushioning element that is already in place to absorb and distribute the mechanical loads from the press-fit terminal. This beforehand cushioning prevents the circuit board from experiencing excessive stress during the press-fitting process and during subsequent operation, thereby maintaining board stability while preserving the ease of using press-fit terminals for connections.
3Manufacturing precision
If the resin portion is integrally formed via resin filled in the through hole, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The patent merges multiple components (circuit board, through hole, press-fit terminal, and resin portion) into an integrally formed assembly. The resin is filled into the through hole and bonded to both the terminal and the board, creating a unified structure. This merging improves manufacturing precision by ensuring proper alignment and positioning of all components while distributing the complexity across standard manufacturing processes rather than requiring a single complex operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin-filled design enhances the reliability of the semiconductor module by reducing substrate deformation and maintaining electrical connectivity while minimizing the risk of cracking.
Implementation Method 1
the resin portion on the first surface side of the circuit board and the resin portion on the second surface side of the circuit board are integrally formed via a resin filled in the first through hole
Implementation Method 2
an elastically deformable elastic deformation region is formed in the press-fit terminal, and the elastic deformation region is press-fitted into a through hole that is formed on a circuit board to achieve an electrical connection
Data Source
AI summary
A semiconductor module includes: a circuit board on which a first semiconductor chip and a second semiconductor chip are mounted and includes a first through hole formed with a conductor foil therein; a press-fit terminal that is electrically connected to the conductor foil in the first through hole of the circuit board; and a second resin that is disposed on a surface side and a back surface side of the circuit board. Further, the press-fit terminal is provided with a pressure contact portion which is press-fitted into the first through hole and is electrically connected to the conductor foil in the first through hole, and the second resin on the surface side of the circuit board and the second resin on the back surface side of the circuit board are integrally formed via a second resin that is filled in the first through hole.