Semiconductor Module Resin Layout for Better Heat Dissipation

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Solution Overview

Problem

Existing semiconductor modules face challenges in efficiently dissipating heat due to the limited contact range of sealing resins with the lead frame, which restricts thermal conductivity and increases costs.

Innovation Solution

A semiconductor module design featuring a first sealing portion with higher thermal conductivity and a second sealing portion with lower thermal conductivity, both composed of resin compositions, where the first sealing portion is exposed and joins the die pad and stepped portions, while the second sealing portion covers the second face, enhancing heat dissipation and reducing costs by using different resin compositions for specific functions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a single sealing resin is used to seal the die pad, then the manufacturing process is simple, but heat dissipation efficiency is insufficient due to limited contact range with the lead frame

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidsealing material structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The sealing material is divided into two distinct sealing resins: a first sealing resin that contacts the die pad and provides thermal conduction path, and a second sealing resin that seals the remaining portions. This segmentation allows each resin to be optimized for its specific function, with the first resin having higher thermal conductivity to improve heat dissipation from the die pad to the lead frame

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the sealing material are assigned different thermal conductivities based on their functional requirements. The first sealing resin in the thermal conduction path has higher thermal conductivity, while the second sealing resin in non-critical regions has lower thermal conductivity. This local quality differentiation optimizes heat dissipation efficiency where needed while maintaining overall sealing performance

Inventive Principle:

Principle #3Local quality

2Temperature

If a sealing resin with high thermal conductivity is used throughout, then heat dissipation is improved, but the cost of the semiconductor module increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

High thermal conductivity resin is applied locally only where thermal conduction is critical (the first sealing resin contacting the die pad), while lower cost resin is used in non-critical sealing regions (the second sealing resin). This localized application of high-performance material optimizes heat dissipation efficiency while controlling overall material costs

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The thermal conductivity parameter of the sealing material is varied spatially by using different resin compositions in different regions. The first sealing resin has higher thermal conductivity for optimal heat dissipation, while the second sealing resin has lower thermal conductivity but sufficient sealing performance, thereby reducing overall material cost while maintaining heat dissipation efficiency

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves heat dissipation efficiency while reducing the overall cost of the semiconductor module by utilizing resin compositions with varying thermal conductivities in specific areas, optimizing thermal conductance and formability.

Implementation Method 1

a first sealing portion joined to the first face and constituted of a first resin composition... a second sealing portion joined to the second face and constituted of a second resin composition lower in thermal conductivity than the first resin composition

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230420323A1Semiconductor module, and manufacturing method for semiconductor module

Publication Date: 2023.12.28 FUJI ELECTRIC CO LTD

AI summary

A semiconductor module includes: a first die pad having a first face, and a second face directed in a direction opposite to the first face, a first outer lead positioned in the direction in which the second face is directed relative to the first die pad, a first inner lead connecting the first die pad and the first outer lead to each other and having a stepped portion, a first semiconductor chip joined to the second face, and a sealing material sealing the first die pad and the first semiconductor chip, in which the sealing material includes a first sealing portion joined to the first face and constituted of a first resin composition, and a second sealing portion joined to the second face and constituted of a second resin composition lower in thermal conductivity than the first resin composition, and the first sealing portion has an exposed face constituting a part of an outer surface of the sealing material, a first joining face joined to the first die pad, and a second joining face joined to the stepped portion along a height direction of the stepped portion.