Semiconductor Module Partition Surface Layout Against Resin Peeling
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Solution Overview
Problem
Power semiconductor modules face the challenge of preventing the peeling of sealing resin from the structure, which can lead to wire breakage and reliability issues, especially as module sizes vary and stress on the surface increases.
Innovation Solution
A semiconductor module design featuring an outer frame with a partition section that differentiates the peeling strength between two surface sections, ensuring the peeling strength on the side with connection sections is higher than on the side without, thereby preventing resin peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the module size is increased to handle higher current and withstand voltage, then the power handling capability is improved, but the stress on the sealing resin surface increases causing peeling
Solution Approach 1:
The partition section is designed with different surface roughness on different sides: the first surface section (where connection sections are arranged) has higher surface roughness to increase peeling strength, while the second surface section has lower surface roughness. This local differentiation of surface properties prevents sealing resin peeling on the critical side while maintaining the overall power handling capability of the enlarged module.
2Strength
If the sealing resin is made more adhesive to prevent peeling, then the bonding strength is improved, but the stress concentration increases leading to wire breakage
Solution Approach 1:
The partition section implements localized surface roughness differentiation: the first surface section has higher roughness to provide strong bonding without excessive stress concentration, while the second surface section has lower roughness. This local quality variation allows the bonding strength to be sufficient for preventing peeling on the connection side while avoiding the harmful effect of stress concentration that would cause wire breakage.
Data Source
AI summary
There is provided a semiconductor module capable of preventing the peeling of a sealing resin on the side where connection sections used for the connection to semiconductor elements are arranged. A semiconductor module includes: an outer frame; sealing resins; gate signal output terminals, and partition sections laid across the outer flame to partition a space into a plurality of housing sections, in the partition sections which the gate signal output terminals with connection sections exposed are arranged. The partition sections have first surface sections on the side where the connection sections are arranged and second surface sections formed, on the side where the connection sections are not arranged, such that the peeling strength to the sealing resins is lower than that of the first surface sections.