Semiconductor Module Resin Relief Part Insulation
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Solution Overview
Problem
Conventional semiconductor modules experience cracking and separation of the sealing resin at the end portion of the die pad frame, which affects the insulation between the clip frame and the semiconductor chip.
Innovation Solution
A semiconductor module design featuring a die pad frame with a protrusion and laser grooves, a clip frame with a groove on its lower surface, and a sealing resin with a specific linear expansion coefficient, which improves adhesion and insulation while preventing resin cracking or separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the clip frame is disposed close to the semiconductor chip to improve insulation, then insulation performance is improved, but the sealing resin is prone to cracking and separation at the end portion of the die pad frame
Solution Approach 1:
A resin relief part is introduced as an intermediary structure between the clip frame and the die pad frame. This resin relief part extends in the width direction of the die pad frame and provides a relief region where the sealing resin can be disposed, acting as a buffer zone that mediates the stress between the clip frame and die pad frame, preventing crack propagation while maintaining insulation performance
Solution Approach 2:
The invention changes the structural parameters of the die pad frame by adding a resin relief part with specific geometric features (extending in the width direction, having a relief region). This structural parameter change creates additional space for the sealing resin, allowing the system to maintain both close spacing for insulation and sufficient resin integrity by modifying the physical configuration rather than material properties
2Reliability
If the end portion of the clip frame is positioned above the semiconductor chip to ensure proper electrical connection, then electrical connectivity is improved, but cracks occur in the sealing resin near the end portion
Solution Approach 1:
The resin relief part serves as a mediator between the clip frame end portion and the die pad frame. By providing a dedicated relief region for sealing resin disposal, it absorbs the mechanical stress and thermal expansion differences that would otherwise cause cracks, allowing the clip frame to maintain its position for proper electrical connection without compromising sealing resin integrity
Solution Approach 2:
The resin relief part provides beforehand cushioning by pre-establishing a stress-absorbing region in the sealing resin. This relief region is designed in advance to accommodate thermal expansion and mechanical stress, cushioning against crack formation before it can occur during operation, while allowing the clip frame to be positioned for optimal electrical connectivity
Data Source
AI summary
A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, the first clip frame, the first clip conductive connection member, and the conductive connection member for die pad.