Semiconductor Module Resistance Parts for Transistor Alignment
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Solution Overview
Problem
The manufacturing efficiency of semiconductor modules is hindered by the need to connect resistance elements to each transistor chip without misalignment, as traditional resistance elements with leads are not self-supporting, leading to potential alignment issues during module assembly.
Innovation Solution
A semiconductor module design featuring a substrate with multiple transistor chips, where control electrode pads are connected to resistance parts with integrated resistance elements and linking parts, allowing for easier alignment and connection without the need for additional support, thereby reducing misalignment and enhancing manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional resistance elements with leads are used for each transistor chip, then voltage oscillation can be suppressed, but manufacturing efficiency decreases due to alignment difficulties
Solution Approach 1:
Multiple resistance elements are integrated into a single resistance part structure that is mounted on the substrate. This consolidation allows one resistance part to serve multiple transistor chips simultaneously, eliminating the need to individually position and connect separate resistance elements to each chip, thereby resolving the contradiction between reliable voltage suppression and manufacturing efficiency
2Manufacturing precision
If resistance elements are connected to each transistor chip individually, then proper resistance control is achieved, but connection complexity increases leading to misalignment
Solution Approach 1:
A substrate with integrated resistance parts serves as an intermediary structure between the transistor chips and the resistance elements. The resistance parts are pre-positioned on the substrate with connection terminals that align with the control electrode pads of multiple transistor chips, simplifying the connection process and eliminating misalignment issues while maintaining precise resistance control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design facilitates efficient manufacturing of semiconductor modules by reducing the complexity of connecting resistance elements, minimizing misalignment, and allowing for high-speed operation by suppressing voltage fluctuations through integrated resistance elements.
Implementation Method 1
it is necessary to suppress unnecessary oscillation (voltage oscillation) of a control signal in order to achieve switching operation at a higher frequency. For that reason, the control signal may be supplied to the control electrode pad via a resistance element
Data Source
AI summary
A semiconductor module (10A) according to one embodiment includes a plurality of first and second transistor chips (hereinafter, first and second transistors) (12A, 12B) and a substrate (90). In each of the first and second transistors, first and second main electrode pads (18, 20) are each electrically connected together; the second main electrode pads of the first transistors are electrically connected to the first main electrode pads of the second transistors; control electrode pads of the first and second transistors are respectively connected to first and second control electrode wiring patterns (94, 98) on the substrate via first and second resistance parts (13A, 13B); and the first and second resistance parts respectively have a plurality of first and second resistance elements (72A, 72B) each connected to the corresponding control electrode pad, and first and second linking parts (74A, 74B) respectively linking the plurality of first and second resistance elements together.