Semiconductor Module Insulating Structure for Heat and RF Stability
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Solution Overview
Problem
The integration of a metal plate on top of a semiconductor element disrupts the electromagnetic field distribution, leading to deteriorated heat dissipation and high-frequency characteristics in semiconductor devices during high-frequency operations.
Innovation Solution
A semiconductor device design featuring a conical insulating member bonded to the semiconductor element, where the side surface of the insulating member is positioned outside a criterion conical surface, allowing for efficient heat dissipation and minimizing interference with the electromagnetic field, thereby maintaining high-frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal plate is bonded to the top surface of the semiconductor element to enhance heat dissipation, then heat dissipation characteristics are improved, but high-frequency characteristics deteriorate due to electromagnetic field disturbance
Solution Approach 1:
An insulating member is introduced as an intermediary between the semiconductor element and the heat dissipation structure. This insulating member has a specific conical shape that allows it to serve dual functions: providing thermal conduction path while maintaining electromagnetic field distribution for high-frequency operation. The insulating member mediates between the conflicting requirements of heat dissipation and high-frequency performance.
Solution Approach 2:
The patent changes the geometric parameters of the insulating member, specifically designing it with a conical shape where the side surface position is determined by a criterion conical surface. This parameter optimization allows the insulating member to achieve both adequate heat dissipation and minimal electromagnetic field disturbance, resolving the contradiction between thermal and electrical performance.
2Temperature
If the insulating member is positioned to maximize heat transfer, then heat dissipation is improved, but electromagnetic field disturbance increases affecting high-frequency performance
Solution Approach 1:
The insulating member exhibits local quality differentiation through its conical shape. The region near the semiconductor element contact point provides optimal thermal conduction, while the broader base region minimizes electromagnetic field disturbance. This spatial variation in functional priority allows simultaneous optimization of heat transfer and electromagnetic compatibility.
Solution Approach 2:
The patent addresses the two-dimensional conflict between heat transfer path and electromagnetic field distribution by introducing a three-dimensional conical geometry. The height dimension of the conical insulating member allows it to extend into the heat dissipation path while its tapered shape gradually reduces electromagnetic interference, effectively resolving the contradiction through dimensional optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the deterioration of heat dissipation and high-frequency characteristics by providing an unobstructed heat transfer path and reducing electromagnetic field disturbances, enhancing the overall performance of the semiconductor device.
Implementation Method 1
The heat generated by the transistor reaches the insulating member via the first insulating layer. The heat reaching the insulating member moves toward the opposite surface of the insulating member while spreading laterally
Data Source
AI summary
A device layer is on a first surface which is one surface of a first insulating layer. The device layer includes a transistor including source regions and drain regions, a source contact electrode connected to a source contact region on surfaces of the source regions, a drain contact electrode connected to a drain contact region on surfaces of the drain regions, wires, and vias. An insulating member is bonded to a second surface of the first insulating layer opposite to the first surface. A conical surface whose apex is located on the second surface, whose central axis is a straight line perpendicular to the second surface, and whose generatrix is a half-line extending toward the insulating member at an angle of 45° with respect to the central axis is defined as a criterion conical surface.