Power Semiconductor Module Same-Height Frame Design
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Solution Overview
Problem
Conventional power semiconductor modules experience stress on wire connections between power semiconductor elements and control integrated circuits due to step height differences, leading to potential disconnection or short circuits.
Innovation Solution
A power semiconductor module design where the first and second frame portions are bent to be at the same vertical height, with a wire connecting the power semiconductor element and control integrated circuit, and an insulator portion sealing the components to alleviate stress on the wire ends, preventing disconnection and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power semiconductor element and control integrated circuit are mounted on frames at different heights to achieve heat dissipation and insulation, then heat dissipation and insulation are improved, but stress on the wire connection increases causing potential disconnection or short circuit
Solution Approach 1:
The patent applies the equipotentiality principle by positioning the first surface of the first frame portion and the third surface of the second frame portion at the same height (distance of 0.1 mm or less). This eliminates the step height difference that previously caused stress concentration on the wire, while still maintaining heat dissipation and insulation functions through the frame structure design.
2Reliability
If gold is used for wire material to ensure connection stability, then connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies this principle by replacing expensive gold wire with cheaper aluminum wire. The improved mechanical structure (frames at same height) compensates for the lower inherent strength of aluminum, making the cheaper material viable while maintaining connection reliability.
3Adaptability or versatility
If the wire is made longer to connect components at different heights, then connection flexibility is improved, but stress on the wire increases and loop stability deteriorates
Solution Approach 1:
By positioning both frames at the same height, the patent eliminates the need for long wires to bridge height differences. The wire can be kept short and direct, improving loop stability while maintaining connection flexibility through the planar arrangement of components.
Data Source
AI summary
A power semiconductor module has a first frame portion, a power semiconductor element, a second frame portion, a control integrated circuit, a wire, and an insulator portion. The power semiconductor element is mounted on a first surface of the first frame portion. The control integrated circuit is mounted on a third surface of the second frame portion for controlling the power semiconductor element. A wire has one end connected to the power semiconductor element and the other end connected to the control integrated circuit. The first surface of the first frame portion and the third surface of the second frame portion are located at the same height in a direction vertical to the first surface of the first frame portion.