Power Semiconductor Module Short-Circuit Failure Mode Control
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Solution Overview
Problem
In high voltage direct current (HVDC) power transmission and static var compensators, existing semiconductor modules with short-circuit failure mode (SCFM) rely on autonomous transitioning of devices, which requires high voltage and is not always reliable, leading to inefficient current distribution and increased cooling requirements.
Innovation Solution
A circuit and method that force multiple semiconductor devices into SCFM by supplying a high-voltage pulse to the gate of healthy devices, causing them to short-circuit and share current, reducing energy needed for transition and enhancing module reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor devices autonomously transition into SCFM relying on heat dissipation, then the failure mode is passive and simple, but the transition is not always reliable and requires sufficiently high voltage
Solution Approach 1:
The patent applies preliminary action by proactively forcing neighboring devices into SCFM immediately after detecting a failure, rather than waiting for autonomous transition. The high-voltage unit detects the failure and supplies a high-voltage pulse to the gate of neighboring devices to force them into SCFM, ensuring reliable transition without depending on uncertain autonomous processes or requiring sufficiently high operating voltage.
2Reliability
If only one device transitions into SCFM, then the current distribution becomes unbalanced, but forcing multiple devices into SCFM requires additional control mechanisms
Solution Approach 1:
The patent applies feedback by using the high-voltage unit to detect when a semiconductor device fails and transitions into SCFM. Based on this detection, the system automatically supplies high-voltage pulses to the gates of neighboring devices to force them into SCFM, creating a feedback loop that ensures balanced current distribution across multiple devices while maintaining controlled complexity through automated response.
Solution Approach 2:
The system applies self-service by automatically responding to failures without external intervention. When a device fails, the high-voltage unit autonomously detects the condition and forces neighboring devices into SCFM, enabling the system to self-correct and maintain balanced current distribution without requiring complex external control mechanisms.
3Loss of energy
If a single device takes over entire current after failure, then the module structure remains simple, but heat dissipation increases and cooling requirements rise
Solution Approach 1:
The patent applies preliminary action by forcing multiple neighboring devices into SCFM immediately after detecting a failure, before the single device would have to handle the entire current load. This proactive current sharing prevents excessive heat dissipation in a single device and reduces cooling requirements, while the automated high-voltage pulse mechanism maintains simplicity despite the sophisticated current sharing behavior.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves current distribution, reduces heat dissipation, and lowers cooling requirements, making the power semiconductor modules more reliable and efficient by ensuring that current is shared among multiple short-circuited devices.
Implementation Method 1
The high-voltage pulse is set to cause an excessive current through the semiconductor die of the at least one of the other semiconductor devices resulting in the transitioning of the device into SCFM
Implementation Method 2
an electrically conducting alloy of, e.g., silicon and a metal layer applied to the silicon, is formed by virtue of heat dissipated as a consequence of the failure, thereby short-circuiting the semiconductor device
Implementation Method 3
heat dissipated as a consequence of the failure, thereby short-circuiting the semiconductor device
Data Source
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AI summary
A circuit comprising a power semiconductor module (200) having an improved short-circuit failure mode (SCFM) is provided. The power semiconductor module comprises at least two semiconductor devices (211-216) being arranged for transitioning into SCFM in the event of a device failure, a collector terminal for collectively connecting the collectors of the devices, and an emitter terminal for collectively connecting the emitters of the devices. The circuit further comprises means (240) for supplying, in response to one (211) of the semiconductor devices transitioning into SCFM, a high-voltage pulse to the gate of the other semiconductor device (212-216), thereby triggering a transitioning of the other device into SCFM. This is advantageous in that it leads to an improved current distribution within the module since the current is shared by more than one short-circuited device. Further, a method of a power semiconductor module is provided.