Power Semiconductor Module Sealant Device for Leakage Prevention
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Solution Overview
Problem
Existing power semiconductor modules face challenges in cost-effectively and automatably connecting the substrate carrier to the housing while preventing silicone rubber leakage during manufacturing.
Innovation Solution
A power semiconductor module design featuring a housing with a recess for the substrate carrier, using a one-piece sealing device made of permanently elastic plastic and fastening means that form a riveted connection through temperature and/or ultrasound deformation, eliminating the need for tight rivet connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate carrier is connected to the housing by means of adhesive connection and rivet connection to ensure sealing against silicone rubber escape, then sealing reliability is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The sealing device integrates multiple functions into a single component: it provides sealing against silicone rubber escape, serves as a mechanical connection element between housing and substrate carrier, and eliminates the need for separate adhesive and rivet connections. This merging reduces structural complexity while maintaining sealing reliability.
Solution Approach 2:
The invention extracts the sealing function from the rivet connection structure by introducing a dedicated sealing device made of permanently elastic plastic. This separates the sealing function from the mechanical fastening function, allowing each to be optimized independently and simplifying the overall connection structure.
2Reliability
If adhesive connection is used to prevent silicone rubber leakage during manufacturing, then sealing is improved, but automation and cost-effectiveness deteriorate
Solution Approach 1:
The invention replaces the chemical adhesive bonding process with a mechanical connection system using the permanently elastic plastic sealing device. This substitution enables automated manufacturing through mechanical insertion and deformation processes, eliminating the need for adhesive application and curing steps while maintaining effective sealing.
Solution Approach 2:
The sealing device utilizes temperature and/or ultrasound parameters to deform the permanently elastic plastic into its final sealing position. This allows for automated, controlled deformation processes that are more suitable for mass production than adhesive application, improving both automation capability and cost-effectiveness.
3Reliability
If tight rivet connections are used to ensure sealing, then sealing reliability is improved, but manufacturing complexity and automation difficulty increase
Solution Approach 1:
The sealing device is designed to be dynamically deformable during the connection process. The permanently elastic plastic can be deformed by temperature and/or ultrasound to achieve the sealing position, and this dynamic deformation process is more amenable to automation than traditional tight rivet connections that require precise mechanical alignment and force control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures a cost-effective and automatable production method with enhanced sealing and reduced leakage risks during the filling of silicone rubber, while maintaining a durable connection to the cooling component.
Implementation Method 1
The sealing device is made from a second permanently elastic plastic
Implementation Method 2
a riveted connection is produced by deforming the ends of these extensions by means of the action of temperature and/or ultrasound
Implementation Method 3
a riveted connection is produced by deforming the ends of these extensions by means of the action of temperature and/or ultrasound
Data Source
Figure 1~2
Figure 3~4
AI summary
The invention describes a power semiconductor module comprising a housing made of a first plastic, at least one substrate carrier with a circuit arrangement formed thereon, and electrical connection elements extending from the circuit arrangement. The housing includes fastening means for permanent connection to the substrate carrier, and the housing has a permanently elastic sealing device made of a second plastic, formed integrally with the housing and circumferentially oriented towards a first inner main surface of the substrate carrier. The associated method comprises the essential steps of: forming a housing from a first mechanically stable plastic and a sealing device made of a second permanently elastic plastic; arranging the at least one substrate carrier on the housing; and permanently connecting the housing to the substrate carrier by means of the fastening means.