Power Semiconductor Module Sealing Frame Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power semiconductor modules are vulnerable to liquid and moisture ingress, which can lead to failures due to lack of effective sealing mechanisms.
Innovation Solution
A one-piece housing with a peripheral sealing frame and a cover that overlaps the frame, featuring a sealing rib on the housing recess and a bent load connection element with a contact device, ensuring liquid and moisture are prevented from entering the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional housing designs without integrated sealing frames are used, then manufacturing steps are reduced, but liquid and moisture can penetrate into the module
Solution Approach 1:
The sealing frame is merged with the housing to form a single integrated component. The housing is formed in one piece with a peripheral sealing frame on the upper side, eliminating the need for separate sealing frame installations and ensuring reliable liquid and moisture protection without significantly increasing manufacturing complexity
Solution Approach 2:
The housing serves multiple functions: it provides structural support, contains the power semiconductor components, and simultaneously acts as a sealing barrier through the integrated peripheral sealing frame. This multi-functionality prevents liquid and moisture ingress while maintaining design simplicity
2Reliability
If rigid contact devices are used without bending capability, then structural stability is improved, but thermal expansion and mechanical strain cannot be compensated
Solution Approach 1:
The load connection element incorporates a bend that allows dynamic adjustment and flexibility. This bent configuration enables the contact device to accommodate thermal expansion and mechanical strain while maintaining electrical contact, transforming a rigid structure into a dynamically adaptable one
Solution Approach 2:
The bent configuration of the load connection element specifically addresses thermal expansion by allowing the metal to expand and contract within the bend without causing stress damage to the rigid housing or substrate, compensating for temperature-related length changes
3Reliability
If the sealing rib height is less than the housing cavity depth, then the contact device can fit properly, but liquid can penetrate into the housing interior
Solution Approach 1:
The sealing rib is designed with a height that protrudes above the housing cavity depth to preemptively block liquid and moisture before they can penetrate into the housing interior. This preliminary barrier prevents harmful ingress while maintaining proper contact device fitment through appropriate dimensional design
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A power semiconductor module (10) with a housing (12) is described, in which load connection elements (16) are arranged, the load connection elements having contact devices (17). The contact devices (17) are arranged in housing recesses (26) of the housing (12). The housing recesses (26) are formed on a corresponding side wall (28) of the housing (12). The housing (12) is closed with a cover (14). To prevent the ingress of liquid or moisture into the power semiconductor module (10), the housing (12) is formed in one piece with a circumferential sealing frame (22) on its upper side, and the cover (14) has an outer rim (24) that overlaps the circumferential sealing frame (22). The respective housing recess (26) has a sealing rib (34) on its inner rim (30), which forms a section of the sealing frame (22).The associated load connection element (16) is formed with a bend (36) around the sealing rib (34), to which the associated contact device (17) is integrally connected.