Semiconductor Module Sealing Layer for Corrosion Resistance
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Solution Overview
Problem
Conventional power semiconductor modules are prone to corrosion and mechanical stress due to the penetration of corrosive gases and thermal expansion, leading to reduced reliability and lifespan, especially in environments with hydrogen sulfide and high temperatures.
Innovation Solution
A module-type semiconductor device with a sealing material layer having specific mechanical characteristics, including a first and second protruding portion, is used to fill the gaps between the case and cover, enhancing sealability and resistance to corrosive gases and thermal stress, while maintaining the module's structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional power semiconductor module structure is used, then the module can be manufactured with standard processes, but the module is prone to corrosion and mechanical stress from thermal expansion, leading to reduced reliability
Solution Approach 1:
The patent applies a sealing material layer (flexible film) between the case and cover to prevent corrosive gas penetration. This sealing layer accommodates thermal expansion while maintaining the seal, resolving the contradiction between reliability and resistance to harmful factors.
Solution Approach 2:
The patent uses a composite structure combining the sealing material layer with the case and cover assemblies. This composite approach provides both mechanical strength and sealing functionality, improving reliability while resisting corrosive gases and thermal stress.
2Reliability
If the case and cover are directly assembled without a sealing material layer, then the manufacturing process is simpler, but gaps between components allow corrosive gases to penetrate and cause corrosion
Solution Approach 1:
The sealing material layer acts as a flexible film that prevents corrosive gas penetration through gaps between the case and cover. This simple addition provides corrosion protection without significantly complicating the overall device structure.
3Reliability
If a sealing material layer is added between the case and cover, then sealability and resistance to corrosive gases are enhanced, but the device structure becomes more complex
Solution Approach 1:
The sealing material layer is implemented as a thin flexible film that provides effective sealing against corrosive gases. This approach enhances reliability while minimizing the increase in device complexity through the use of a simple, thin sealing component.
4Strength
If the sealing material layer has high rigidity, then structural strength is improved, but mechanical stress from thermal expansion cannot be absorbed, leading to cracking
Solution Approach 1:
The sealing material layer is designed with flexible properties to absorb mechanical stress from thermal expansion. This flexibility prevents cracking while maintaining sufficient structural strength, resolving the contradiction between strength and stress resistance.
Solution Approach 2:
The patent optimizes the physical parameters of the sealing material layer, including its elasticity and thickness, to balance structural strength with the ability to absorb thermal stress. This parameter optimization prevents cracking while maintaining adequate strength.
5Reliability
If the sealing material layer has high elasticity, then thermal stress is absorbed effectively, but the layer becomes too soft to provide adequate structural support
Solution Approach 1:
The patent optimizes the elasticity parameter of the sealing material layer to achieve the right balance. The layer has sufficient elasticity to absorb thermal stress while maintaining adequate structural support capability through controlled material properties and layer thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents the ingress of corrosive gases and reduces mechanical stress, thereby enhancing the reliability and longevity of power semiconductor modules in harsh environments, as demonstrated by improved results in impact, heat cycle, and corrosive gas tests.
Implementation Method 1
a first adhesive layer adhering the inner walls of the case to the side surfaces of the cover, closing a first gap between the case and the cover
Implementation Method 2
The first adhesive layer has a first protruding portion, or a second protruding portion, or both the first protruding portion and the second protruding portion
Implementation Method 3
enhancing sealability and resistance to corrosive gases and thermal stress
Implementation Method 4
The encapsulant covers and electrically insulates side surfaces (surfaces of the insulated substrate 121 and ends of the metallic foil 123) of the circuit board 102, the semiconductor chip 101 and the conductive plate 122
Implementation Method 5
The cooling base conducts heat to a heat dissipating fin, the heat being generated by the semiconductor chip 101 and transmitted through the circuit board 102
Data Source
AI summary
A semiconductor device includes a substrate having a first main surface on which a semiconductor chip is mounted, a case adhered to a peripheral edge of the substrate to form a recess in which the semiconductor chip is disposed, a cover disposed in the case with a first gap in a direction parallel to the first main surface between the cover and the case such that a second main surface of the cover faces the first main surface, and a first adhesive layer embedded in the first gap. The first adhesive layer has a first protruding portion and/or a second protruding portion, the first and second protruding portions respectively protruding outside and inside the recess from the first gap while being in contact with the inner walls of the case and respectively a third main surface of the cover opposite to the second main surface, and the second main surface.