Semiconductor Module Sealing Structure for Crack-Resistant Reliability
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Solution Overview
Problem
The reliability of semiconductor modules needs to be improved.
Innovation Solution
A semiconductor module is designed with a circuit board, a semiconductor chip, a wiring member, and a sealing resin. The sealing resin consists of a first resin with an inorganic filler and epoxy resin, covering the semiconductor chip, and a second resin with a lower elastic modulus, separated from the semiconductor chip and circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a sealing resin with high inorganic filler content is used to protect the semiconductor chip, then the thermal resistance and mechanical strength are improved, but the resin becomes brittle and prone to crack propagation
Solution Approach 1:
The sealing resin is divided into two distinct layers: a first sealing resin layer with high inorganic filler content (50-90 wt%) providing mechanical strength and thermal resistance, and a second sealing resin layer with low inorganic filler content (0-20 wt%) providing flexibility and crack resistance. This segmentation allows each layer to perform its specialized function without compromise.
Solution Approach 2:
Different regions of the sealing resin are given different compositions tailored to local requirements: the first layer near the chip requires high strength and thermal resistance, while the second layer at the outer surface requires flexibility and stress absorption. This local quality differentiation optimizes overall reliability.
2Temperature
If a single-layer sealing resin with high inorganic filler is used, then thermal resistance and structural support are improved, but stress concentration occurs leading to reduced reliability
Solution Approach 1:
The sealing resin is segmented into two layers with different thermal and mechanical properties. The first layer handles thermal management close to the chip, while the second layer absorbs external stress, preventing stress concentration that would occur in a single-layer structure.
Solution Approach 2:
The sealing resin structure uses a composite of two different resin compositions: an epoxy-based first layer with high filler content for thermal resistance, and a silicone-based second layer with low filler content for stress resistance. This composite structure achieves both thermal and mechanical reliability.
3Ease of manufacture
If the sealing resin is made as a single homogeneous structure, then manufacturing is simplified, but the resin cannot simultaneously provide both high strength and flexibility
Solution Approach 1:
While maintaining relatively simple manufacturing processes, the sealing resin is segmented into two layers with distinct functions. The first layer provides structural integrity and thermal management, while the second layer provides flexibility and environmental protection, achieving multiple functions without significantly complicating manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of the semiconductor module by providing thermal resistance and preventing crack propagation, while also optimizing the resin structure to reduce stress and improve protection.
Implementation Method 1
The sealing resin may have a first resin including an inorganic filler and an epoxy resin, which covers the semiconductor chip
Implementation Method 2
The sealing resin may have a second resin provided on a surface of the first resin, which has a smaller elastic modulus than the first resin
Data Source
AI summary
A semiconductor module is provided, comprising a circuit board having a predetermined circuit pattern, a semiconductor chip placed on the circuit board, a wiring member configured to connect the semiconductor chip and the circuit pattern, and a sealing resin configured to seal the semiconductor chip and the wiring member, wherein the sealing resin has a first resin including an inorganic filler and an epoxy resin, which covers the semiconductor chip and a second resin having a smaller elastic modulus than the first resin, which is provided on a surface of the first resin, and wherein the second resin is separated from the semiconductor chip and the circuit board.