Semiconductor Module Thermal Management via Segmented Connector
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Solution Overview
Problem
Semiconductor modules face challenges in integrating semiconductor elements with high density and efficiently releasing heat, as existing technologies often lead to overheating due to heat transfer between elements.
Innovation Solution
A semiconductor module design where a connector is positioned between the first semiconductor element and the second circuit board, allowing direct heat transfer to the circuit boards without passing through the second semiconductor element, thereby reducing heat flow and enabling efficient heat release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor elements are integrated with high density, then the quantity of semiconductor elements increases, but heat release efficiency deteriorates due to heat transfer between elements
Solution Approach 1:
The connector is divided into multiple portions: a first portion sandwiched between the first semiconductor element and the first circuit board, and a second portion sandwiched between the first semiconductor element and the second circuit board. This segmentation allows heat to be divided and transferred to multiple heat dissipation paths simultaneously, improving overall heat release efficiency while maintaining high-density integration.
Solution Approach 2:
The connector acts as an intermediary component that facilitates direct heat transfer from the first semiconductor element to both circuit boards. By positioning the connector between the semiconductor element and circuit boards without passing through the second semiconductor element, it mediates the heat transfer path to prevent heat accumulation and improve thermal management in high-density configurations.
2Device complexity
If heat is transferred through the second semiconductor element, then the heat transfer path is simplified, but the second semiconductor element overheats due to excessive heat accumulation
Solution Approach 1:
The heat transfer function is extracted from the second semiconductor element by introducing a dedicated connector component. The connector's first portion is positioned between the first semiconductor element and the first circuit board, extracting the heat transfer function from the second semiconductor element and preventing heat accumulation that would cause overheating.
Solution Approach 2:
The connector serves as an intermediary component that provides a dedicated heat transfer path between the first semiconductor element and the circuit boards. This intermediary structure allows heat to bypass the second semiconductor element, preventing thermal overload while maintaining functional integration.
3Stability of the object's composition
If the connector passes through the second semiconductor element, then the structural integration is improved, but heat transfer efficiency deteriorates due to thermal resistance
Solution Approach 1:
The connector is segmented into distinct portions positioned between the first semiconductor element and each circuit board separately. This segmentation avoids passing through the second semiconductor element, eliminating the thermal resistance that would be introduced by traversing additional material layers, while still achieving structural integration through the multi-portion connector design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses overheating by allowing direct heat transfer from the first semiconductor element to both circuit boards, enhancing heat radiation and reducing the risk of the second semiconductor element being heated by the first.
Implementation Method 1
heat of the first semiconductor device is transferred directly to the second circuit board, without through the second semiconductor element
Data Source
Figure 1A~1B
Figure 2
Figure 3A
AI summary
A first circuit board having thermal conductivity; a second circuit board having thermal conductivity and disposed opposing the first circuit board; a first semiconductor element joined to an opposing surface of the first circuit board opposing the second circuit board; a second semiconductor element joined to an opposing surface of the second circuit board opposing the first circuit board; and a connector electrically connecting the first semiconductor element and the second semiconductor element. The connector includes a portion which is sandwiched between the first semiconductor element and the second circuit board without through the second semiconductor element, and which is in contact with the first semiconductor element and the second circuit board.