Semiconductor Module Layout for Easier Sensor and Electrode Assembly
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Solution Overview
Problem
Conventional semiconductor devices face challenges in assembly and manufacturing cost due to complex configurations and the need for precise placement of sensors and electrodes, which complicates the integration of current sensors and temperature sensors.
Innovation Solution
The semiconductor device design includes a semiconductor substrate with specific well regions and a protective layer that simplifies the assembly by dividing the emitter electrode into regions, allowing for easier connection and reducing the complexity of sensor placement, while maintaining the performance and withstand capability of the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensors and electrodes are precisely placed in conventional semiconductor devices, then device performance is maintained, but assembly complexity and manufacturing cost increase
Solution Approach 1:
The device structure is segmented into distinct functional regions: a first region containing a sensor element (temperature sensor or current sensor), a second region containing an active element, and a third region containing an electrode. This spatial segmentation allows each component to be independently designed and placed, simplifying the assembly process while maintaining precise functional performance.
Solution Approach 2:
Different regions of the semiconductor device are assigned different functional qualities: the first region is optimized for sensing (with appropriate sensor element properties), the second region for active device operation, and the third region for electrical connection. This local optimization allows each region to perform its specific function effectively without compromising overall device performance.
2Reliability
If sensors and electrodes are precisely placed in conventional semiconductor devices, then device performance is maintained, but manufacturing cost increases
Solution Approach 1:
By dividing the device into distinct regions with clearly defined functions and placement zones, the manufacturing process can use standardized placement techniques for each region type, reducing the need for complex custom placement procedures and lowering manufacturing costs.
Solution Approach 2:
The sensor element, active element, and electrode are positioned in predetermined regions during the manufacturing process, allowing for systematic and automated assembly rather than requiring complex post-assembly adjustments, thereby reducing manufacturing cost.
3Adaptability or versatility
If complex configurations are used in semiconductor devices, then sensor integration capability is enhanced, but ease of assembly deteriorates
Solution Approach 1:
The semiconductor device is divided into distinct functional regions: a first region for sensor elements, a second region for active elements, and a third region for electrodes. This segmentation allows different sensor types (temperature sensors or current sensors) to be integrated in the first region without complicating the assembly of other components, as each region has a defined purpose and placement zone.
Solution Approach 2:
Each region is optimized for its specific function: the first region accommodates sensor elements with appropriate local properties, the second region contains active elements, and the third region provides electrode placement. This local optimization enables versatile sensor integration while maintaining simple assembly procedures through standardized regional placement.
Data Source
AI summary
Provided is a semiconductor device including: a semiconductor substrate; an active portion provided on the semiconductor substrate; a first well region and a second well region arranged sandwiching the active portion in a top view, provided on the semiconductor substrate; an emitter electrode arranged above the active portion; and a pad arranged above the first well region, away from the emitter electrode, wherein the emitter electrode is provided above the second well region. The provided semiconductor device further includes a peripheral well region arranged enclosing the active portion in a top view, wherein the first well region and the second well region may protrude to the center side of the active portion rather than the peripheral well region.