Semiconductor Module with Embedded Sensor and Wiring
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Solution Overview
Problem
Conventional semiconductor modules face challenges in downsizing while effectively cooling semiconductor chips and accurately measuring refrigerant temperatures, leading to increased module size and manufacturing costs.
Innovation Solution
A semiconductor module design featuring a terminal case made of resin with a temperature sensor integrated into the side wall, a refrigerant circulating portion, and cooling fins, where the temperature sensor is positioned to minimize stress and maximize accuracy, and wiring is embedded within the side wall to reduce module size and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the temperature sensor is provided outside the terminal case, then the temperature measurement is accurate, but the module size increases and manufacturing cost increases
Solution Approach 1:
The temperature sensor is embedded within the terminal case structure, specifically positioned in the bottom wall or side wall to directly contact the refrigerant circulating portion. This nesting approach allows the sensor to be integrated into the existing module volume without requiring additional external space, thereby maintaining measurement accuracy while preventing module size increase.
Solution Approach 2:
The temperature sensor is combined with the terminal case as an integrated component rather than a separate external part. The sensor is embedded during the molding process or installed within the case structure, merging the sensing function with the housing structure. This integration eliminates the need for separate mounting space and reduces the overall module volume while maintaining measurement precision through direct contact with the refrigerant.
2Measurement precision
If the temperature sensor is provided outside the terminal case, then the temperature measurement is accurate, but the manufacturing cost increases
Solution Approach 1:
The temperature sensor is integrated into the terminal case as a unified component. The sensor can be embedded during the injection molding process of the terminal case, allowing simultaneous manufacturing of the case and sensor housing. This merging reduces the number of separate parts, eliminates additional assembly steps, and lowers manufacturing costs while maintaining measurement accuracy through direct refrigerant contact.
Solution Approach 2:
The terminal case serves multiple functions: it houses the semiconductor chip, provides structural support, and integrates the temperature sensor for refrigerant temperature monitoring. By making the terminal case multi-functional, the design eliminates the need for separate sensor housings and mounting structures, thereby reducing part count and manufacturing complexity while maintaining measurement precision.
3Ease of operation
If the wiring is provided outside the terminal case, then the wiring is easy to connect, but the module size increases and complexity increases
Solution Approach 1:
The wiring is embedded within the terminal case structure, with conduits or channels formed during the molding process to guide and protect the wiring. This nesting approach allows the wiring to be routed through the case itself rather than requiring external wiring harnesses, reducing the module's external dimensions while maintaining ease of connection through pre-formed wiring paths and integrated connectors.
4Reliability
If the thickness of the resin side wall is large, then the temperature sensor is protected from stress, but the temperature measurement accuracy decreases due to thermal insulation
Solution Approach 1:
The terminal case is designed with non-uniform wall thickness: the region around the temperature sensor has reduced thickness to minimize thermal insulation and improve measurement accuracy, while other regions maintain sufficient thickness for structural strength and sensor protection. This local quality variation allows the sensor to be protected from mechanical stress while maintaining thermal contact with the refrigerant for accurate temperature sensing.
Solution Approach 2:
The resin material composition is varied locally: the side wall material has lower thermal conductivity for structural integrity, while the bottom wall or sensor-contact region uses material with higher thermal conductivity to improve heat transfer to the sensor. This local material property variation protects the sensor from stress while ensuring accurate temperature measurement through enhanced thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves efficient cooling and accurate temperature measurement, enabling downsizing of the semiconductor module while reducing manufacturing costs and maintaining temperature measurement precision.
Implementation Method 1
a cooling portion including a refrigerant circulating portion through which a refrigerant flows
Implementation Method 2
a temperature sensor for sensing a temperature of the refrigerant is provided on the side wall
Data Source
AI summary
A semiconductor module is provided to downsize the module, the semiconductor module including a terminal case made of a resin for housing a semiconductor chip; and a cooling portion including a refrigerant circulating portion through which a refrigerant flows and a joining portion surrounding the refrigerant circulating portion, the refrigerant circulating portion being arranged below the terminal case, and the cooling portion being arranged directly or indirectly in close contact with the terminal case at the joining portion, wherein the terminal case is provided above the joining portion, and has a side wall provided so as to surround the semiconductor chip when seen in a top view, and a temperature sensor for sensing a temperature of the refrigerant is provided on the side wall.