High-Power Semiconductor Module Integrated Short-Circuit Device
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Solution Overview
Problem
High-power semiconductor modules in multilevel converter systems face challenges with fault management, as mechanical bypass switches are costly, require regular maintenance, and not all failure modes can be reliably short-circuited, potentially leading to overcharging and energetic surges.
Innovation Solution
Integration of a high-power semiconductor module with a short-circuit device on a common substrate, where a sacrificial region is destroyed by a current pulse to create a persistent conducting path upon failure, allowing controlled bypassing without external mechanical switches, and optionally incorporating a mechanical bypass for added safety.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mechanical bypass switch is used to bypass faulty semiconductor modules, then system reliability is improved, but device complexity and maintenance requirements increase
Solution Approach 1:
The bypass function is merged with the semiconductor module itself by integrating a bypass diode and capacitor directly into the module circuitry. This eliminates the need for separate mechanical bypass switches and their associated control systems, reducing device complexity while maintaining the ability to bypass faulty modules through semiconductor-based protection circuits.
Solution Approach 2:
The patent replaces mechanical bypass switches with solid-state semiconductor components (bypass diodes and capacitors). This substitution eliminates moving parts, reduces maintenance requirements, and enables faster response times while maintaining the bypass functionality for faulty modules.
2Reliability
If mechanical bypass switches are used, then faulty modules can be bypassed, but cost and maintenance needs increase
Solution Approach 1:
The patent employs inexpensive semiconductor components (diodes and capacitors) that can be easily manufactured and integrated into each module. These solid-state components are cheaper than mechanical switches and have no moving parts, eliminating maintenance needs while providing reliable bypass functionality throughout the system's operational life.
3Device complexity
If semiconductor modules are designed without integrated bypass capability, then device complexity is reduced, but safety and functionality are compromised during faults
Solution Approach 1:
The patent incorporates capacitors and bypass diodes into each semiconductor module design from the outset. These components are pre-configured to absorb voltage spikes and provide alternative current paths before faults can cause damage, cushioning against overcharging and surge currents without adding significant complexity to the overall system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables safe and cost-effective operation of high-power semiconductor modules by reliably bypassing faulty components, reducing maintenance needs and preventing overcharging, while maintaining system functionality with reduced component count and complexity.
Implementation Method 1
a sacrificial region, which is configured for being destroyed by a current pulse triggered by the trigger signal
Data Source
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AI summary
A high-power semiconductor module (10) is proposed, which comprises a high-power semiconductor device (12) mounted on the module (10) and comprising at least two electrical connections (14a, 14b). The module (10) further comprises a short-circuit device (16) mounted on the module (10). The short-circuit device (16) is adapted to generate a persistent electrically conducting (92) path between the two electrical connections (14a, 14b) upon receiving a trigger signal (23) by electrically destroying a semiconductor (30, 32) of the high-power semiconductor module (10).