Semiconductor Module Side Surface Control Terminal Routing
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Solution Overview
Problem
Existing semiconductor modules have limited signal wire routing options due to control electrode terminals only protruding from the peripheral portion, requiring complex arrangements and increased manufacturing costs.
Innovation Solution
The semiconductor module design features control and second terminals on all side surfaces of the package, allowing for flexible signal wire routing and simplification by enabling lateral connection without the need for opening in the busbar, thereby reducing manufacturing complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the control electrode terminal only protrudes from a part of the peripheral portion, then the structure is simpler, but the signal wire routing becomes complex and requires greater drawing length
Solution Approach 1:
The control electrode terminal is extended from protruding only from the upper surface to protruding from all side surfaces of the package. This dimensional expansion allows signal wires to be drawn from any direction, transforming a limited single-point connection into a multi-directional connection system, thereby simplifying wire routing paths and reducing drawing length.
2Ease of operation
If the control electrode terminal protrudes from all side surfaces, then the signal wire routing is simplified, but the device complexity increases
Solution Approach 1:
The control electrode terminal structure is designed to serve multiple functions simultaneously: it provides electrical connection points on all four side surfaces for flexible wire routing, maintains structural integrity of the package, and enables simplified signal wire arrangement. This multi-functional design achieves routing simplification without proportionally increasing overall device complexity.
3Adaptability or versatility
If signal wires are drawn with great length around the driver, then the driver arrangement flexibility is maintained, but the manufacturing cost increases
Solution Approach 1:
By providing control electrode terminals on all side surfaces rather than only the upper surface, the invention enables signal wires to be drawn directly from adjacent sides, significantly reducing wire length and eliminating the need for wires to travel great distances around the driver, thereby reducing manufacturing costs while preserving arrangement flexibility.
Data Source
AI summary
According to one aspect of the present disclosure, a semiconductor module includes a semiconductor chip having a first electrode, a second electrode, and a control electrode to receive a control signal that controls a current flowing between the first electrode and the second electrode, a package having an upper surface, a back surface that is an opposite surface of the upper surface, and a plurality of side surfaces provided between the upper surface and the back surface, the package containing the semiconductor chip, a first terminal provided to the package and being electrically connected to the first electrode, a second terminal provided to the package and being electrically connected to the second electrode and a control terminal electrically connected to the control electrode and being provided on all of the plurality of side surfaces of the package so as to surround the package.