Semiconductor Module Signal Assembly Layout for Lower Parasitic Inductance
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Solution Overview
Problem
The existing design of semiconductor power modules with protruding signal sources leads to increased parasitic inductance due to longer current paths, affecting performance and reliability.
Innovation Solution
A semiconductor module design featuring a substrate with a signal assembly disposed in the normal direction, covered by a first molding compound exposing the signal assembly and a second molding compound filling the opening, which reduces current path length and balances packaging stress through independent molding compound components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the signal source protrudes from the side of the package, then the package structure can accommodate multiple semiconductor elements, but the current path length increases leading to higher parasitic inductance
Solution Approach 1:
The signal assembly is repositioned from a side-protruding configuration to a vertical arrangement along the normal direction of the substrate. This dimensional change in signal source placement shortens the current path length and reduces parasitic inductance while maintaining the ability to accommodate multiple semiconductor elements in the package structure
2Device complexity
If a single molding compound is used to cover the chip, then the packaging process is simplified, but the packaging stress cannot be effectively balanced and the pull-out force of the signal assembly is reduced
Solution Approach 1:
The packaging structure is segmented into two distinct molding compounds: a first molding compound that covers the chip and provides mechanical support, and a second molding compound that fills the opening and exposes the signal assembly. This segmentation allows independent optimization of each molding compound's properties, effectively balances packaging stress, and increases the pull-out force of the signal assembly, thereby improving structural reliability
Data Source
Figure 1A~1B
Figure 1C
Figure 1D
AI summary
A semiconductor module (100) includes a substrate (110), at least one chip (120), at least one signal assembly (130), a first molding compound (140), and a second molding compound (150). The chip (120) is disposed on the substrate and electrically connected to the substrate. The signal assembly is disposed on the substrate in a normal direction (N) of the substrate and electrically connected to the substrate. The first molding compound is disposed on the substrate. The first molding compound at least covers the chip and has at least one opening (142), and the opening exposes the signal assembly. The second molding compound is disposed on the substrate and fills the opening. The second molding compound is located between the signal assembly and the first molding compound, and covers the signal assembly. At least one contact interface (B) is formed between the second molding compound and the first molding compound.