Semiconductor Module Signal Pad Thermal Dissipation
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Solution Overview
Problem
Conventional semiconductor modules face limitations in heat radiation performance due to signal pads being connected to the outside via bonding wires, preventing effective heat dissipation from these areas.
Innovation Solution
A semiconductor module design where the signal pad is thermally connected to a heat sink via signal wiring, allowing both the source and signal pad areas to act as active regions for current flow and heat generation, thereby enhancing heat radiation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If signal pads are connected to the outside via bonding wires, then electrical connection is achieved, but heat radiation performance deteriorates
Solution Approach 1:
The patent merges the electrical connection function and heat dissipation function into a single integrated structure. The signal wiring serves dual purposes: conducting electrical signals and conducting heat away from the signal pads. This eliminates the need for separate bonding wires for electrical connection, as the same wiring structure performs both functions simultaneously.
Solution Approach 2:
The signal wiring is designed to perform multiple functions: it provides electrical connection between signal pads and external terminals, conducts heat from the signal pads to the heat sink, and serves as a structural component of the module. This multi-functionality resolves the contradiction by making the connection structure itself the heat dissipation path.
2Productivity
If heat sinks are arranged on front surface and back surface of power element, then current density is improved, but signal pad heat dissipation remains insufficient
Solution Approach 1:
The patent applies local quality by providing targeted heat dissipation specifically at the signal pad locations. While heat sinks are present on both surfaces of the power element for general heat management, additional signal wirings are specifically positioned to conduct heat from the signal pads to the heat sinks, addressing the local heat dissipation need at signal pad areas that differs from the bulk power element.
3Temperature
If signal wiring thermally connects signal pad to heat sink, then heat radiation efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
By merging the electrical signal transmission path and the heat conduction path into the same signal wiring structure, the patent ensures that wherever the wiring is positioned for electrical connection, it automatically provides thermal conduction. This integration reduces the need for separate precision alignment of dedicated thermal paths, as the electrical connection geometry itself defines the thermal path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat radiation efficiency by creating a double-sided heat dissipation path and allows for increased current density, while maintaining effective temperature detection and minimizing heat retention during current cutoffs.
Implementation Method 1
The heat sink cools the power element
Implementation Method 2
The signal pad is thermally connected to the heat sink via the signal wiring
Data Source
AI summary
A semiconductor module includes a power element, a signal wiring, and a heat sink. The signal wiring is connected to a signal pad of the power element. The heat sink cools the power element. The power element has an active area provided by a portion where the signal pad is formed. The signal pad is thermally connected to the heat sink via the signal wiring.