Semiconductor Module Signal Routing Optimization
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Solution Overview
Problem
Semiconductor modules experience reduced processing speed and signal distortion due to signal delay times that are proportional to the distance from the connector on the module board, leading to inefficiencies in data transmission.
Innovation Solution
The semiconductor module design includes a module substrate with semiconductor packages arranged in specific directions and connection regions, where data signal terminals and command/address signal terminals are electrically connected to the module substrate in a manner that reduces the distance to the connection element, optimizing signal routing and processing speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If semiconductor packages are arranged on the module substrate with conventional routing, then the module can be manufactured with standard design, but signal delay time increases and processing speed decreases
Solution Approach 1:
The patent applies local quality by creating different routing regions with distinct characteristics. Data signal terminals are routed through a first region closer to the electric connection element, while command/address signal terminals use a second region farther away. This localized differentiation optimizes signal paths based on specific signal requirements, minimizing delay for data signals while providing adequate routing for control signals.
Solution Approach 2:
The patent utilizes the spatial dimension on the module substrate by defining multiple routing regions at different distances from the electric connection element. By arranging connection regions in a two-dimensional layout with varying radial distances, the patent creates optimized signal paths that reduce transmission distance for critical data signals without compromising the overall module design.
2Reliability
If signal transmission paths are lengthened to accommodate all connections, then all terminals can be connected, but signal distortion increases and processing speed decreases
Solution Approach 1:
The patent implements local quality by establishing distinct routing regions with different optimal path lengths. The first region for data signals is positioned closer to the electric connection element, creating shorter transmission paths that reduce signal distortion. The second region for command/address signals is positioned farther away, providing adequate length for control signal routing while maintaining signal integrity.
Solution Approach 2:
The patent segments the connection region into multiple distinct areas: a first region for data signal terminals and a second region for command/address signal terminals. This segmentation allows each signal type to have its own optimized transmission path, preventing signal distortion by keeping data signal paths short while providing separate routing for control signals.
3Device complexity
If all signal terminals are routed through the same connection region, then routing is simplified, but signal delay and distortion increase due to uniform path lengths
Solution Approach 1:
The patent applies local quality by creating differentiated routing regions with specific characteristics for different signal types. The first region is optimized for data signals with shorter paths to minimize delay, while the second region accommodates command/address signals with different routing requirements. This localized optimization maintains manageable complexity while significantly improving signal transmission speed.
Solution Approach 2:
The patent segments the module substrate into distinct routing regions: a first connection region for data signals and a second connection region for command/address signals. This segmentation simplifies routing by providing dedicated paths for each signal type, reducing cross-interference and optimizing transmission speed without creating excessive complexity.
Data Source
AI summary
A semiconductor module, comprising: a module substrate with an electric connection element; at least one semiconductor package provided on the module substrate, the at least one semiconductor package including a plurality of semiconductor chips; and a connection region electrically connecting the semiconductor package to the module substrate, wherein the connection region comprises: a first region electrically connected between data signal terminals of a first chip of the semiconductor chips of the semiconductor package and the module substrate; a second region electrically connected between data signal terminals of a second chip of the semiconductor chips of the semiconductor package and the module substrate; and a third region electrically connected between command/address signal terminals of both the first and second chips of the semiconductor package and the module substrate, wherein the first region is closer to the electric connection element of the module substrate, compared with the third region.