Power Semiconductor Module Sleeve Forming Without Contaminants
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Solution Overview
Problem
Existing methods for forming sleeves or rivets in power semiconductor modules often create contaminants that can affect the module's functionality, and are cumbersome, requiring significant space and tools that complicate the layout of the module.
Innovation Solution
A method involving a punch to exert a pressing force on a metal layer, causing the material to flow and form a sleeve either upwards or downwards, without removing or ablating material, allowing for efficient and cost-effective mechanical and electrical coupling of terminal elements to the substrate, thereby avoiding contamination and simplifying the module layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing methods for forming sleeves or rivets are used, then mechanical and electrical coupling can be achieved, but contaminants are created that affect module functionality
Solution Approach 1:
The invention extracts and eliminates the harmful byproduct (contaminants) from the sleeve forming process. Instead of using methods that generate contaminants, a cold forming process is employed that shapes the metal layer directly without material removal or ablation, thus taking out the contamination problem from the manufacturing process.
Solution Approach 2:
The invention changes the physical parameters of the forming process from thermal/ablation-based methods to cold mechanical forming. By applying pressing force through a punch to plastically deform the metal layer into a sleeve shape, the process parameters are changed to eliminate contaminant generation while maintaining the mechanical and electrical coupling function.
2Ease of manufacture
If existing sleeve forming methods are used, then coupling can be achieved, but the process is cumbersome and requires significant space and tools
Solution Approach 1:
The invention merges the sleeve forming operation with the existing metal layer structure. The punch directly forms the sleeve from the metal layer material itself through plastic deformation, combining what would otherwise be separate operations (creating a hole, inserting a sleeve, securing it) into a single integrated forming step that reduces tool complexity and space requirements.
Solution Approach 2:
The metal layer serves itself by being directly formed into the sleeve shape through the punching process. The material undergoes plastic deformation to create the sleeve structure in-place, eliminating the need for separate sleeve components and complex assembly tools, thereby simplifying the manufacturing process and reducing space requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively forms sleeves without contaminants, enhancing the reliability and efficiency of power semiconductor modules by eliminating the need for separate connection procedures and reducing the complexity of module layout.
Implementation Method 1
pressing force that forces material of the metal layer to flow up against a stroke of the punch, thereby forming a sleeve
Data Source
Figure 1~2
Figure 3A~4B
Figure 5~8
AI summary
A method comprises exerting a pressing force on a section of a first surface of a metal layer by means of a punch, wherein either the metal layer is arranged on a working surface, with a second surface of the metal layer facing the working surface, wherein the second surface is arranged opposite the first surface, and the punch is pressed against the section of the first surface with a pressing force that forces material of the metal layer to flow up against a stroke of the punch, thereby forming a sleeve extending from the first surface in a vertical direction and away from the second surface, or the punch is pressed against the section of the first surface and forced through the metal layer towards the second surface with a pressing force that forces material of the metal layer to flow down with a stroke of the punch, thereby forming a sleeve extending from the second surface in a vertical direction and away from the first surface. The method further comprises, after forming the sleeve, arranging the metal layer in a housing of a power semiconductor module.