Semiconductor Module Lead Frame Solder Flow Control
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Solution Overview
Problem
Existing semiconductor modules have unused space on terminals and limited compactification potential, leading to inefficiencies in lead frame usage and mounting density.
Innovation Solution
A semiconductor module with a solder flow suppressing section, featuring an uneven shape, notch, or hole on the lead frame, which restricts solder flow and positional deviation, allowing for improved component mounting accuracy and density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the semiconductor module uses conventional terminal design without solder flow suppression, then the terminals have large unused space and lower mounting density, but adding solder flow suppressing sections increases the complexity of the lead frame structure
Solution Approach 1:
The lead frame is designed with localized uneven shapes, notches, or holes only in specific regions where solder flow needs to be controlled, rather than modifying the entire structure. This allows precise control of solder flow to improve mounting precision while minimizing the overall structural complexity of the lead frame.
2Volume of moving object
If the semiconductor module increases component mounting density to reduce size, then the module becomes more compact, but solder flow control becomes more difficult leading to positional deviation
Solution Approach 1:
The solder flow suppressing sections (uneven shapes, notches, or holes) are pre-formed on the lead frame before component mounting. These features proactively counteract the natural solder flow that would otherwise cause positional deviation, enabling high mounting density while maintaining positioning accuracy by preventing solder migration during the soldering process.
3Quantity of substance
If the semiconductor module uses more terminals to accommodate all components, then all components can be mounted, but the unused space on terminals increases and the module size increases
Solution Approach 1:
Multiple terminal functions are merged into fewer terminals by integrating multiple electrical connections and mounting functions into consolidated terminal structures. The solder flow suppressing sections enable multiple components to be reliably mounted on reduced numbers of terminals, thereby decreasing the total terminal count and reducing module size while maintaining the ability to accommodate all necessary components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the effective use of the lead frame, achieves a more compact module size, and increases yield by suppressing solder flow and positional deviations, thereby improving mounting density and reducing manufacturing defects.
Implementation Method 1
a solder flow suppressing section capable of restricting a direction of flow of solder is formed in the vicinity of the solder portion of the component mounted by solder thereon
Data Source
AI summary
A semiconductor module can be realized, which is formed by mounting an electronic component and a bus bar by solder on a lead frame including a plurality of terminals, wherein a solder flow suppressing section capable of restricting a direction of flow of solder on the lead frame is formed in the vicinity of the solder portion of the component mounted by solder, and by this configuration, positional deviation, such as rotation or movement of the mounted component, is suppressed and the size of the module can be made compact.