Semiconductor Module Solid Heat Radiation Substrates Curvature
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Solution Overview
Problem
Conventional semiconductor modules face challenges with heat radiation substrate curvature due to temperature changes and require complex bonding processes, leading to increased manufacturing steps and potential heat resistance deterioration.
Innovation Solution
The semiconductor module design features lead frames on opposite surfaces of semiconductor chips with symmetric, solid conductive portions of heat radiation substrates joined to these frames, eliminating the need for bonding wires by using joining materials to connect signal line terminals directly to the chips, thereby reducing curvature and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding processes are used to connect lead frames to semiconductor chips, then electrical connections can be established, but the manufacturing process becomes complex and heat resistance deteriorates
Solution Approach 1:
The invention extracts and eliminates the bonding wire component from the conventional semiconductor module structure. Instead of using separate bonding wires to connect lead frames to semiconductor chips, the lead frames are directly connected to the chips through conductive portions of the heat radiation substrate, thereby simplifying the manufacturing process and improving heat resistance by removing an additional interface that could deteriorate under thermal stress
Solution Approach 2:
The invention merges the functions of the bonding wire connection and the heat radiation substrate connection into a single integrated structure. The lead frames are directly joined to the semiconductor chips through the conductive portions of the heat radiation substrate, combining electrical connection and heat radiation functions into one unified pathway, thereby reducing manufacturing steps and improving thermal performance
2Manufacturing precision
If heat radiation substrates are subjected to temperature changes during manufacturing, then they can be joined to semiconductor chips, but curvature develops in the substrates
Solution Approach 1:
The invention applies asymmetric temperature control during the manufacturing process. The heat radiation substrate is selectively heated only in the regions where lead frames need to be joined to the semiconductor chips, while other portions of the substrate remain at lower temperatures. This asymmetric heating approach allows for localized joining without causing overall curvature of the substrate, thereby maintaining both manufacturing precision and joining reliability
Solution Approach 2:
The invention implements local quality control by applying temperature changes only to specific regions of the heat radiation substrate where joining is required. Instead of uniformly heating the entire substrate, the process targets only the conductive portions that need to be joined to lead frames, preventing thermal-induced curvature while enabling reliable local joining
3Productivity
If multiple bonding steps are used to connect signal line terminals, then electrical connections are established, but manufacturing time increases
Solution Approach 1:
The invention implements preliminary action by pre-forming conductive portions on the heat radiation substrate that are ready to receive lead frames. The substrate is prepared in advance with integrated conductive pathways, eliminating the need for subsequent bonding steps to establish electrical connections. This preliminary preparation significantly reduces manufacturing time and simplifies the overall process
Solution Approach 2:
The heat radiation substrate serves multiple functions simultaneously: it provides thermal management, establishes electrical connections, and provides mechanical support. The conductive portions of the substrate universally handle both heat radiation and electrical conduction tasks, eliminating the need for separate bonding wires and reducing the number of manufacturing steps required
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the connection between semiconductor chips and lead frames, reduces curvature of heat radiation substrates, and simplifies the manufacturing process by eliminating the need for bonding wires, resulting in improved heat resistance and manufacturing efficiency.
Implementation Method 1
a joining material 20, 21
Implementation Method 2
a first heat radiation substrate 12 joined to the first lead frame 9, and a second heat radiation substrate 15 joined to the second lead frame 11
Data Source
AI summary
A semiconductor module is configured such that heat radiation substrates are connected to lead frames and semiconductor chips are directly connected to the lead frames, so that the semiconductor chips are not connected to the lead frames through conductive portions of the heat radiation substrates. Therefore, the conductive portions can have a solid shape without being divided. As such, an occurrence of curving of the heat radiation substrates is suppressed when a temperature is reduced from a high temperature to a room temperature after resin-sealing at the high temperature or the like. Therefore, connection between the semiconductor chip and the lead frames and connection between the lead frames and the heat radiation substrates enhance.