Explosion-protected Semiconductor Module with Sound Absorber
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Solution Overview
Problem
Semiconductor modules are prone to explosions due to current surges, which can damage the environment by vaporizing semiconductor chips and bond wires, leading to electrical short circuits and contamination.
Innovation Solution
A semiconductor module with a sound absorber, such as open polymer foam or mineral wool, is integrated between the semiconductor chip and the housing side wall to attenuate pressure waves generated by explosions, reducing the risk of module damage and external contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor module is designed without explosion protection measures, then the device complexity is low, but the reliability is poor due to potential explosions from current surges
Solution Approach 1:
The patent applies porous sound absorber material (such as open-cell foam) positioned between the semiconductor chip and the housing side wall. This porous material absorbs the shock waves generated during an explosion, preventing the housing from bursting while maintaining a simple overall device structure. The porous structure provides explosion protection without adding complex mechanical protection systems.
2Object-affected harmful factors
If no sound absorber is installed, then the manufacturing cost is low, but harmful factors are increased due to vaporized materials ejecting from the housing
Solution Approach 1:
The sound absorber material is pre-installed in the housing during the manufacturing process, before the module is sealed. This preliminary placement ensures that in the event of an explosion, the vaporized materials will be contained and absorbed by the pre-positioned sound absorber, preventing contamination and short circuits without requiring complex post-manufacturing assembly steps.
3Reliability
If a sound absorber with high flow resistance is used, then explosion protection is improved, but the pressure wave attenuation may affect normal thermal management
Solution Approach 1:
The patent positions the sound absorber material specifically in the region between the semiconductor chip and the housing side wall, rather than filling the entire housing. This localized placement provides explosion protection at the critical interface where shock waves are generated, while leaving other regions of the housing open for effective thermal management and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sound absorber effectively dampens pressure waves, preventing the module housing from bursting and minimizing the risk of electrical short circuits and contamination, thereby enhancing explosion protection.
Implementation Method 1
a first sound absorber (8). The bond wire (4) is arranged in the module housing (7), and the first sound absorber (8) or at least a section of the first sound absorber (8) is arranged between the semiconductor chip (1) and the housing side wall (71)
Data Source
AI summary
A semiconductor module has a carrier, a semiconductor chip mounted on the carrier, a bond wire, a module housing, and a first sound absorber. The module housing has a housing side wall. The bond wire is arranged in the module housing. At least a section of the first sound absorber is arranged between the semiconductor chip and the housing side wall.