Power Semiconductor Module Spacer Bonding Design

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Solution Overview

Problem

Power semiconductor modules with varying semiconductor chip current capacities require adaptable case sizes, leading to increased case diversity and reduced productivity, and existing spacer bonding methods result in weak bond strength.

Innovation Solution

A power semiconductor module design featuring a spacer with bonding surfaces on both the side and main surfaces of the base plate, allowing for uniform case sizes across different base plate sizes, enhanced bond strength, and flexible spacer sizing, using materials like ceramic or rubber to minimize warpage and thermal resistance issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If cases are sized to match base plate areas, then material usage is optimized, but case diversity increases and productivity decreases

Engineering Contradiction:

Improvebase plate materialVSAvoidcase manufacturing

Core Design Contradiction:

Loss of substanceVSProductivity

Solution Approach 1:

A single standard-sized case is designed to accommodate multiple base plate sizes through the use of spacers. The case serves multiple functions: it provides structural enclosure, thermal management housing, and electrical isolation while maintaining uniform dimensions regardless of the specific base plate configuration inside.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

Spacers are introduced as intermediary components between the base plate and the case. These spacers fill the gap between smaller base plates and the standard case interior, enabling a universal case design to work with varying base plate sizes without requiring custom-case fabrication.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If spacers are bonded only to the side surface of the base plate, then assembly is simplified, but bond strength becomes weak

Engineering Contradiction:

Improvespacer assemblyVSAvoidspacer bond strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The bonding interface is extended from a single-side surface attachment to a multi-dimensional bonding configuration. The spacer is bonded to both the side surface and the main surface of the base plate, creating a stronger mechanical connection through increased bonding area and distributed stress points.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Multiple bonding surfaces are combined into a unified bonding system. Instead of bonding the spacer to only one surface, the design merges side surface bonding with main surface bonding, creating a composite bonding structure that leverages the strengths of both attachment methods.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9653369B2Power semiconductor module comprising a case, base plate, and spacer

Publication Date: 2017.05.16 MITSUBISHI ELECTRIC CORP

AI summary

It is an object to provide a power semiconductor module having a case shared for base plates of different sizes and having a high-stability base plate. The power semiconductor module according to the present invention includes: a base plate; an insulating substrate disposed on a first main surface of the base plate; a semiconductor chip disposed on an insulating substrate; a case for enclosing the base plate except a second main surface of the base plate facing the first main surface, the insulating substrate, and the semiconductor chip; and a spacer provided between the outer periphery of the base plate and the inner periphery of the case and in contact with both. The spacer has a bonding surface with a side surface of the base plate and the first main surface in the contact with the outer periphery of the base plate.