Double-Sided Semiconductor Module Assembly Without Spacer Misalignment
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Solution Overview
Problem
Semiconductor modules with double-sided heat dissipation structures face issues with misalignment and poor adhesion due to spacer height deviations, leading to reduced yield and inefficiencies in the bonding process between semiconductor devices and heat dissipation substrates.
Innovation Solution
A semiconductor module design that eliminates the need for a spacer by using bumps to electrically connect semiconductor devices to a circuit board and conductive clips to ensure surface contact with heat dissipation substrates, allowing for direct heat transfer and electrical connection, thereby maximizing heat dissipation and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a spacer is used to compensate for thickness deviation and form a space for molding material injection, then the gap between heat dissipation substrates is secured, but misalignment occurs and adhesion deteriorates due to spacer height deviation
Solution Approach 1:
The patent removes the spacer component from the assembly, eliminating the source of height deviation and adhesion problems. The gap securing function is achieved through the bonding process itself and the compliance of the heat dissipation substrates, rather than through a separate spacer element.
Solution Approach 2:
The patent combines the gap securing function with the bonding process. The bonding material and substrate compliance work together to accommodate thickness variations and secure the gap, integrating multiple functions into a unified system rather than relying on separate components.
2Manufacturing precision
If a spacer is used for each semiconductor device, then thickness deviation is compensated, but the number of bonding processes increases and yield decreases
Solution Approach 1:
The spacer component is removed from the manufacturing process, eliminating the associated bonding steps and reducing process complexity. This directly improves yield by removing failure points related to spacer attachment.
Solution Approach 2:
The heat dissipation substrates themselves provide the thickness compensation through their compliance and the bonding material's properties, eliminating the need for external spacer components and their associated assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency, reduces manufacturing complexities, and increases the number of mountable semiconductor devices per unit area by eliminating spacer-related issues and simplifying the assembly process.
Implementation Method 1
a first heat dissipation substrate, the first heat dissipation substrate being placed on the top of the first semiconductor device
Data Source
Figure 1~2
Figure 3~4A
Figure 4B~5
AI summary
A semiconductor module according to the present disclosure includes a circuit board having a first surface and a second surface; a first semiconductor device, the first semiconductor device being mounted on the first surface of the circuit board; a second semiconductor device, the second semiconductor device being mounted on the second surface of the circuit board; a first heat dissipation substrate, the first heat dissipation substrate being placed on the top of the first semiconductor device, wherein the first heat dissipation substrate is coupled to a second surface of the first semiconductor device; and a second heat dissipation substrate, the second heat dissipation substrate being placed on the top of the second semiconductor device, wherein the second heat dissipation substrate is coupled to a second surface of the second semiconductor device.