Power Semiconductor Module Housing With Matched Spring Compliance
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Solution Overview
Problem
Power semiconductor modules face challenges in achieving good thermal resistance between the substrate and the heat sink or ground surface due to production tolerances, and the assembly process is cumbersome.
Innovation Solution
A power semiconductor module design incorporating a substrate with a dielectric insulation layer and metallization layers, a housing with flexible portions, and press-on pins that exert pressure to ensure proper alignment and thermal contact, compensating for production tolerances by using spring constants that allow for equal bending of the substrate and housing components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cover is used to exert force on the substrate to press it onto the heat sink, then thermal transition is improved, but assembly becomes cumbersome and production tolerances cause insufficient thermal transition
Solution Approach 1:
The patent changes the mechanical parameter of the cover by introducing flexible portions with specific spring constants (0.5*k1≤k2≤5*k1). This allows the cover to adapt to substrate bow and production tolerances while maintaining effective thermal contact, resolving the contradiction between thermal performance and assembly complexity
Solution Approach 2:
The cover transitions from a rigid structure to a dynamic structure with flexible portions that can deform elastically. This dynamic capability allows the cover to compensate for substrate bow and assembly variations, improving thermal transition without complicating the assembly process
2Temperature
If a cover is used to press the substrate onto the heat sink, then thermal contact is improved, but production tolerances result in insufficient thermal transition
Solution Approach 1:
The flexible portions of the cover are designed with spring constants matched to the substrate (0.5*k1≤k2≤5*k1) to provide beforehand cushioning against the effects of substrate bow and production tolerances. This elastic cushioning ensures consistent thermal contact despite manufacturing variations
Solution Approach 2:
By introducing flexible portions with controlled spring constants, the patent changes the mechanical compliance of the cover to accommodate production tolerances. The flexible portions deform elastically to maintain optimal contact pressure between the substrate and heat sink, ensuring consistent thermal transition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides improved thermal resistance and ease of assembly, minimizing the impact of production tolerances and ensuring consistent thermal conductivity.
Implementation Method 1
the substrate in an area vertically below the press-on pin includes a first spring constant k1 in a vertical direction that is perpendicular to a top surface of the substrate, the at least one flexible portion of the cover includes a second spring constant k2, and 0.5*k1≤k2≤5*k1
Data Source
AI summary
A power semiconductor module includes: a substrate with a metallization layer attached to a dielectric insulation layer and a semiconductor body mounted to the metallization layer; a housing at least partly enclosing the substrate and having sidewalls and a cover that at least partly covers an opening formed by the sidewalls and has a flexible portion; and a press-on pin having arranged on the substrate or semiconductor body. A first end of the press-on pin faces the substrate or semiconductor body and extends towards the cover such that a second end of the press-on pin contacts the flexible portion of the cover. The substrate in an area vertically below the press-on pin has a first spring constant k1 in a vertical direction that is perpendicular to a top surface of the substrate. The flexible portion of the cover has a second spring constant k2, where 0.5*k1≤k2≤5*k1.