Semiconductor Module Board With Stacked Tap Regions
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Solution Overview
Problem
The increasing integration density of memory devices necessitates a higher number of taps, which poses challenges in design space limitations, leading to potential shorts and increased insertion force, damaging the memory device.
Innovation Solution
A semiconductor module design with a board featuring multiple tap regions of varying widths, where the second tap region is narrower than the first, allowing for a greater number of taps without increasing device size or reducing pitch, and a socket structure that accommodates this configuration to reduce insertion force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of taps is increased to achieve higher integration density, then the tap count increases, but the pitch between taps must be decreased which causes shorts between taps
Solution Approach 1:
The patent transitions from a single-plane tap arrangement to a multi-dimensional configuration by stacking tap regions vertically. The board includes a first tap region and a second tap region disposed at different heights, allowing taps to be arranged in multiple layers. This vertical dimensionality change enables increased tap count without reducing the pitch between taps on each individual layer, thereby preventing shorts while achieving higher integration density.
Solution Approach 2:
The tap arrangement is segmented into multiple independent tap regions (first tap region and second tap region) located at different vertical positions on the board. Each tap region can be independently designed and manufactured, allowing the system to achieve a higher total tap count by distributing taps across multiple segments rather than concentrating them in a single plane, thus maintaining adequate pitch within each segment.
2Quantity of substance
If the number of taps is increased to achieve higher integration density, then the tap count increases, but the device size must be increased which is not acceptable
Solution Approach 1:
The patent utilizes the vertical dimension by stacking tap regions at different heights on the board. The second tap region is disposed under the first tap region, creating a multi-layer structure. This allows the device to maintain a compact footprint while accommodating a higher number of taps through vertical stacking, effectively increasing integration density without expanding the device's planar dimensions.
Solution Approach 2:
The tap regions are nested vertically, with the second tap region positioned under the first tap region. This nesting arrangement allows multiple tap regions to occupy overlapping or adjacent vertical spaces, maximizing the use of available board volume and enabling higher tap count within the same device envelope.
3Quantity of substance
If the number of taps is increased to achieve higher integration density, then the tap count increases, but the insertion force increases which may damage the memory device
Solution Approach 1:
By arranging taps in multiple vertical layers rather than a single plane, the mechanical stress during insertion is distributed across multiple contact points at different heights. The socket is correspondingly configured with multiple tap regions to receive the stacked tap regions, allowing the insertion force to be distributed rather than concentrated, thereby reducing the peak force on any single tap and preventing damage.
Data Source
AI summary
Example embodiments relate to semiconductor modules and semiconductor devices including the same. The semiconductor module may include a board, a plurality of semiconductor chips, a plurality of first taps, and a plurality of second taps. The board may include a chip region, a first tap region, and a second tap region. The first tap region of the board may have a first width that extends in a thickness direction of the board. The second tap region may have a second width that is less than the first width. The second tap region may be disposed under the first tap region. The semiconductor chips may be mounted in the chip region of the board. The first taps may be disposed in the first tap region, and the second taps may be disposed in the second tap region. The first and second taps may be configured to transmit/receive an electric signal to/from the plurality of semiconductor chips.