Semiconductor Module Housing Structure for Screw-Induced Stress Relief
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Solution Overview
Problem
Conventional semiconductor modules face damage due to excessive stress applied to the housing when a heat dissipating member is screwed to a convexly curved base, leading to potential insulation failure.
Innovation Solution
A semiconductor module design featuring a metal plate-shaped base and a resin frame-shaped housing with adhering portions that satisfy the inequality T1<0.42×L12, where T1 is the thickness and L1 is the length of the adhering portions, to reduce stress and deformation during screwing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the heat dissipating member is screwed to the housing on a convex curved base, then close contact between the base and heat dissipating member is achieved, but excessive stress is applied to the housing causing damage
Solution Approach 1:
The patent introduces a plate-shaped adhering portion made of resin as an intermediary element between the metal base and the housing. This adhering portion has a thickness L1 satisfying 0.05≤L1≤0.5 mm, which allows it to deform and absorb stress while maintaining close contact between the convex curved base and the heat dissipating member, thereby preventing excessive stress from damaging the housing
Solution Approach 2:
The patent specifies precise parameter ranges for the adhering portion thickness L1 (0.05≤L1≤0.5 mm) to optimize its stress-absorbing capability. By controlling this parameter, the adhering portion can effectively accommodate the convex curvature of the base while preventing excessive stress transmission to the housing, thus resolving the contradiction between achieving close contact and protecting housing strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces stress on the housing, minimizing damage and preventing insulation failure by ensuring adequate bonding and mechanical strength.
Implementation Method 1
a frame-shaped housing (50) made of a resin composition, the housing having an adhering portion (5) adhering to an outer peripheral portion of the base
Data Source
AI summary
A semiconductor module includes a plate-shaped base made of metal, and a frame-shaped housing made of a resin composition, the housing having an adhering portion adhering to an outer peripheral portion of the base, wherein in plan view, an outer periphery of the housing includes first sides facing each other and second sides facing each other, a portion of the housing corresponding to each of the second sides is provided with at least one hole for screwing a heat dissipating member, the adhering portion includes a plate-shaped first adhering portion extending along each of the first sides, in plan view, the first adhering portion overlaps an outer periphery of the base, and inequality T1<0.42×L12 is satisfied, when T1 is T1 meters that denote a thickness of the first adhering portion, and L1 is L1 meters that denote a length of the first adhering portion.